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Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler

Ranjith John, Vladimir Dotsenko, Deepnarayan Gupta, Ajay Malshe,
Cryogenic PackagingThermal ManagementMultichip ModulesFinite Element ModelingMCMSolder BumpsUnderfillEpoxy
https://doi.org/10.4071/isom-2011-WP1-Paper5
IMAPSource Conference Papers
John, Ranjith, Vladimir Dotsenko, Deepnarayan Gupta, and Ajay Malshe. 2011. “Thermal Performance of an Adhesive Bonded Superconducting Multichip Module (MCM) on a Gifford-McMahon Cryocooler.” IMAPSource Proceedings 2011 (1): 683–89. https:/​/​doi.org/​10.4071/​isom-2011-WP1-Paper5.
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