This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:30262/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies

Ivan Ndip, Abdurrahman Öz, Christian Tschoban, Stefan Schmitz, Martin Schneider-Ramelow, Stephan Guttowski, Herbert Reichl, Klaus-Dieter Lang,
Bond wire antennaprocess tolerances42 GHz Q-bandpoint-to-point60 GHz WLAN/WPAN
https://doi.org/10.4071/isom-2011-THA1-Paper7
IMAPSource Conference Papers
Ndip, Ivan, Abdurrahman Öz, Christian Tschoban, Stefan Schmitz, Martin Schneider-Ramelow, Stephan Guttowski, Herbert Reichl, and Klaus-Dieter Lang. 2011. “Impact of Process Tolerances on the Performance of Bond Wire Antennas at RF/Microwave Frequencies.” IMAPSource Proceedings 2011 (1): 914–20. https:/​/​doi.org/​10.4071/​isom-2011-THA1-Paper7.

View more stats

Powered by Scholastica, the modern academic journal management system