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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs

Brandon Judd, Maria Durham,
Modern solder materials process control QFN void mitigation
• https://doi.org/10.4071/isom-2016-THA52
IMAPSource Conference Papers
Judd, Brandon, and Maria Durham. 2016. “Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs.” IMAPSource Proceedings 2016 (1): 711–20. https://doi.org/10.4071/isom-2016-THA52.
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