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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs
Brandon Judd
,
Maria Durham
,
Modern solder materials
process control
QFN void mitigation
•
https://doi.org/10.4071/isom-2016-THA52
IMAPSource Conference Papers
Judd, Brandon, and Maria Durham. 2016. “Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNs.”
IMAPSource Proceedings
2016 (1): 711–20.
https://doi.org/10.4071/isom-2016-THA52
.
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