ISSN 2380-4505
Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Anisotropic conductive film for fine-pitch interconnects
Anisotropic conductive film for fine-pitch interconnects
Daniel Nilsen Wright, Branson D. Belle, Kari Schjølberg-Henriksen, Hoang-Vu Nguyen, Jakob Gakkestad, Helge Kristiansen, Maaike M. Visser Taklo,
Articles in Vol. 2016, Issue 1, 2016
Vol. 2016, Issue 1, 2016
- Metallic TIM Testing and Selection for IC, Power, and RF SemiconductorsTim JensenDavid L. Saums
- Anisotropic conductive film for fine-pitch interconnectsDaniel Nilsen WrightBranson D. BelleKari Schjølberg-HenriksenHoang-Vu NguyenJakob GakkestadHelge KristiansenMaaike M. Visser Taklo
- Aluminum bond pad corrosion of wirebond packagesVarughese MathewSheila ChopinOliver ChyanNick RossAlex LambertMuthappan Asokan
- Cost Comparison of Fan-out Wafer-Level Packaging to Fan-out Panel-Based PackagingChet PaleskoAmy Lujan
- Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh EnvironmentCong ZhaoThomas SandersZhou HaiChaobo ShenJohn L. Evans
- The reliability of Ag wedge bonding with various bonding pads for power devicesXing WeiZhou YuGe YanTomonori IizukaKohei Tatsumi
- Achieving Low Voiding with Lead Free Solder Paste for Power DevicesPierino I ZappellaSaeed SedehiRobert HizonAdrienne D. Williams
- Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device ProcessingXiao LiuQi WuDongshun BaiTrevor StanleyAlvin LeeJay SuBaron Huang
- Development and Challenges of Warpage for Fan-Out Wafer-Level Package TechnologyMu-Hsuan ChanYu-Po WangIvan ChangJames ChiangGeorge PanNicholas KaoDavid Wang
- In-situ measuring module for transfer molding process monitoringR. KahleT. BraunJ. BauerK.-F. BeckerM. Schneider-RamelowK.-D. Lang
- NSOP Reduction for QFN RF-IC PackagesMumtaz Y. Bora
- Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic PackagingDaniel D. EvansWenjuan Qi.Kevin Bauder
- An Integrated Sensor for Detecting Moisture Ingress in Printed Circuit Board AssembliesRobert N. DeanNathan B. LodenCurtis J. HartleyJeffery D. Craven
- Minimizing Voiding in Bottom Terminated Components by Optimizing the Solder Paste FluxEd Briggs
- Addressing Next Generation Packaging and IoT with Glass SolutionsAric ShoreyRachel LuKevin AdrianceGene Smith
- High Speed Serial Interfaces in 2.5D Integrated SystemsMuhammad Waqas ChaudharyAndy Heinig
- Optimizing Board Level Reliability of a Novel LGA Package for IoT ApplicationsTara AssiPaul GallesAndrew MawerTrent UehlingSteve Safai
- Smart in-line defectivity/metrology process control solution for advanced 3D integrationAmina SidhoumNicolas DevanciardFranck BanaArnaud GarnierNicolas BressonSandra BosStéphane ReyCarlos BeitiaDario AlliataDarcy HartJohn ThornellJustin MillerGilles VeraScott Balak
- Effect of Vapor-Deposited Parylene Coating on Reliability of Sintered Silver Joints for Extreme Temperature ApplicationsZhenzhen ShenAleksey Reiderman
- Increasing the Reliability of 3D Printing a Wi-Fi Sensor DevicePaul I. DeffenbaughDanielle M. StramelKenneth H. Church
- Washable Coatings for Packaging ProcessesAlex BrewerAlex LaymonJohn Moore
- Effects of x-ray exposure on NOR and NAND flash memories during high-resolution 2D and 3D x-ray inspectionAnju SharmaPreeth SivakumarAndrew FeigelIn Tae BaeLawrence P. LehmanJoseph GregorJames CashJoseph Kolly
- The Die Embedded and RDL structure on the high density substrate (i-THOP®) for mobile applicationMasahiro KyozukaTatsuro YoshidaNoriyoshi ShimizuKoichi TanakaTetsuya Koyama
- Voiding Control at Preform SolderingArnab DasguptaElaina ZitoNing-Cheng Lee
- Ultrasonic System Normalization on Wedge BondersOmid NiayeshVaughn SvendsenRaymond ChenJason FuHenri SeppaenenChristoph Luechinger
- Effects of Probe Marks on Shear Test of Copper Ball Bonds in Two Pad Aluminum ThicknessesPriscila BrownRachel WynderDustin TenneyStevan Hunter
- Introduction to a new silicone adhesive designed for wearables technologiesMichelle PoliskieJavier FregosoRobert Krizan
- Improvement of Coherency of the Panel Level Package by Integrated Dry ProcessShinichi EndoTomoyuki HabuAkira AibaHiroko SuzukiNoritaka TakezoeHiroki HoribeKazuki ArikawaMasaki MiuraHajime KikuiriShintaro Yabu
- Fabrication and characterization of advanced through glass via interconnectsTimothy ClingenpeelArian RahimiSeahee HwangboYong-Kyu YoonAric Shorey
- How Mitigation Techniques Affect Reliability Results for BGAsGreg CaswellMelissa Keener (Black and Decker)
- High-Temperature Acoustic Fluid Velocity Sensor DevelopmentImran MotonRocco DiFoggioJosh LiewOtto Fanini
- Glass Based Inductors, Capacitors and System-In-Package for RF ApplicationsJeb H FlemmingRoger CookKyle McWethy
- Ultra-High Density System-in-Package (SiP) for the Lowest Size Weight and Power (SWAP)Bruce Barbara
- Package Architecture and Component Design for an Implantable Peripheral Nerve Stimulation and Recording System for Advanced ProstheticsCaroline K. BjuneJohn R. LachapelleAndrew CzarneckiAlexander L. KindleJohn R. BurnsCarlos A. SeguraJulianne E. GraingerBrian D. NugentTirunelveli S. SriramPhilip D. ParksEdward KeeferJonathan Cheng
- Fan-Out Wafer-Level-Packaging: Market and Technology TrendsJérôme Azémar
- Isothermal DSC study of the curing kinetics of an epoxy/silica composite for microelectronicsLérys GranadoStefan KempaStefanie BremmertLaurence J. GregoriadesFrank BrüningEric AnglaretNicole Fréty
- High Aspect Ratio Bumping Process with Solder Bumps Included Sintered PillarsS. NakagawaT. YasoshimaH. UnoM. Ishikawa
- Challenges in Assembly implementation of ultra-thin profile flipchip package-on-packageAbu EghanKyoo B Choi
- Additive Printing of Tight Tolerance Embedded Components via High Precision Shadow Masking and Their Integration with Traditional Circuit Board ManufacturingV.D. HeydemannS. LauerW. DeckerJ. SlaterJ. Mazurowski
- Advantages and limitations of ceramic packaging technologies in harsh applicationsThomas BartnitzekTorsten ThelemannStefan ApelKarl-Heinz Suphan
- Higher Efficiency Power Module Solutions by Chip EmbeddingKay S EssigCT ChiuJarris KuoPhidia ChenJean-Marc Yannou
- High Speed Fluorescent Inspection of Non-visible defectsGurvinder SinghChet SureshJohn ThornellWoo Young Han
- Addressing Flux Dip Challenges for 3D Integrated Large Die, Ultra-fine Pitch InterconnectC. Marsan-LoyerD. DanovitchN. Boyer
- Evaluation of a Lead-Free Ultra Low Temperature Co-Fire Ceramic (ULTCC) Tape Designed for Lamination on Aluminum Substrates and a Compatible Co-Fireable Silver ConductorSteven GrabeySamson ShahbaziRyan PersonsCaitlin Shahbazi
- Transient liquid phase sintering materials (TLPS) vs. conventional solders for high temperature MLCC interconnects.John McConnellJ. BultitudeL. JonesJ. Qazi
- 3D SiP Assembly and Reliability for Glass Substrate with Through ViasRa-Min TainDyi-Chung HuKai-Ming YangYu-Hua ChenJui-Tang ChenDe-Shiang LiuChen-Hao Lin
- Highly Selective Wet Silicon Etch Chemistry and Process for Advanced Semiconductor PackagingYongqiang LuSian CollinsLaura B. MauerJohn TaddeiJohn Clark
- Packaging for medical and wellness applicationsA. RouzaudM. CartierJ-C. SouriauG. SimonJ. BrunG. Pares
- Co-Design and Demonstration of a Fully Integrated Optical Transceiver Package Featuring Optical, Electrical, and Thermal Interconnects in Glass SubstrateBruce ChouBrett SawyerWilliam VisRyuta FuruyaFuhan LiuVenky SundaramRao Tummala
- Novel Mold-free Fan-out Wafer Level Package using Silicon WaferAmit KelkarVivek SridharanKhanh TranKiyoko IkeuchiAnu SrivastavaViren KhandekarRicky Agrawal
- High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor PackageHoward (Hwail) JinKewei XuLoreto NaungayanJose Quinones
- Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness LossQianfei SuA. Ege EnginJerry Aguirre
- Embedded RDL formation in Non-Photo Polymers using Excimer Laser AblationHabib HichriSeongkuk LeeMarkus ArendtSanjay MalikOgnian DimovRaj SakamuriVenky Sundaran
- Advanced Wafer Level Packaging of RF-MEMS with RDL InductorPaul CastillouRoberto GaddiRob van KampenYaojian LinBabak JamshidiSeung Wook Yoon
- The True Cost of Hermeticity in Microelectronic PackagingTimothy Dittman
- Design of BGA Assemblies with Enhanced Thermal Cycle Capability Using Solder Coated Polymer BallsThomas F. MarinisJoseph W. Soucy
- A Comparison of Immersion Gold and Tin Surface Finishes on Sensing Electrodes for PCB Environmental Saltwater Concentration SensorsRobert N. DeanFrank T. WernerMichael J. Bozack
- High viscosity paste dosing for microelectronic applicationsT. ThomasS. VogesT. BraunS. RaatzR. KahleK.-F. BeckerM. KochM. FliessJ. BauerM. Schneider-RamelowK.-D. Lang
- Voltammetric Detection of Low Copper Concentrations in Nickel Plating BathsMichael PavlovMitchell CoffinDanni LinEugene Shalyt
- Understanding Whisker Growth: Effect of Substrate and UnderlayerPiyush JagtapPraveen Kumar
- Electrodeposited copper-graphite composites for low-CTE integrated thermal structuresShreya DwarakanathP. Markondeya RajKaya DemirVanessa SmetVenky SundaramRao Tummala
- Direct write lithography approach for Panel Level PackageHiroshi MatsuiTatsuya NagaoYoshinao Norimitsu
- Optimization of laser release layer, glass carrier, and organic build-up layer to enable RDL-first fan-out wafer-level packagingAlvin LeeJay SuBaron HuangRam TrichurDongshun BaiXiao LiuWen-Wei ShenYu-Min LinTao-Chih ChangHsiang-Hung ChangChia-Wei ChiangHuan-Chun FuK. C. ChenYu-Lan LuKuan-Neng Chen
- Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit CarriersAarief Syed-KhajaChristopher KaestleJoerg Franke
- Study of Void Formation Mechanism in Electroplated SnAg Solder BumpKoji TatsumiAkio SakaiSyunsuke KawaiTakuma KataseTakashi MiyazawaMasayuki Ishikawa
- Reliability of SAC 105 and SAC1205N under Drop TestsJia-Shen LanStuwart FanLouie HuangMei-Ling Wu
- Challenges in Fine Feature Solder Paste Printing for SiP ApplicationsSze Pei-LimKenneth ThumAndy Mackie
- Reliability of Heavy Gage Aluminum Wire-bonds under High Temperature AgingNishant LakheraEmmanuel LabroyeCatherine ProngaFlorence MolinieSamuel Lesnakowski
- Simulation and Measurement of Power Distribution Networks (PDN)Pin Jen Wang (Alvin)Sharmin IslamFred BarlowAicha Elshabini
- Novel Core-Shell Conductive Materials for LTCC MetallizationsRichard StephensonKyle BandaccariHoward Imhof
- Advances in Wire Bonding Technology for Overhang ApplicationsAashish ShahGary SchulzeNestor MendozaJ.H. YangRob EllenbergIvy QinBob Chylak
- Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out)Eoin O'TooleSteffen KroehnertJosé CamposVirgilio BarbosaLeonor Dias
- Ultrasonic Bonding on Unstable PinHenri Seppänen
- Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of ReliabilityYoungtak LeeDoug Link
- Unique Silicon Passive Component Technology for Medical implants combining highly flexible integration with outstanding performances.Catherine BunelFranck Murray
- Spurious Turn-On inside a Power Module of Paralleled SiC MOSFETsZichen MiaoKhai D. T. Ngo
- Advanced wire bonding for high reliability and high temperature applicationsM. GuyenotM. ReinoldY. ManiarM. Rittner
- Effect of Temperature/Humidity Treatment on Interfacial Reliability on Screen-Printed Ag / Polyimide for Advanced Embedded Packaging TechnologiesKyu Hawn LeeByung-Hyun BaeMin-Su JeongJeong-Kyu KimYoung-Bae Park
- Investigation of the Direct Plating Copper (DPC) on Al2O3, BeO or AlN Ceramic Substrates for High Power Density ApplicationsHo-Chieh (Jay) YuJason Huang
- Ultra thin, low ESL and high frequency performance of high density silicon capacitorsCatherine BunelFranck Murray
- Innovative Uses for Plasma Surface Conditioning in the Assembly of Electronic DevicesKhoren SahagianEd Prack
- Investigation of the Defect Size and Density in Thin SiON Filmfor Organic Device EncapsulationKunmo ChuKi Deok BaeByong Gwon SongYong Young ParkJaekwan KimWenxu XianyuChang Seung Lee
- Design and Process Considerations in Transitioning From Aluminum Wire to Aluminum RibbonC. ItalianoY. Mindin M. Oud
- Joint Healing Thermal Interface MaterialJingting YangJason StraderSean OrzolekEugene PrussPhillip FosnotJesse Galloway
- Computer-Aided Predictive Reliability Risk Analysis for High-Temperature Operation of Subsurface Electronics DevelopmentJosh LiewOtto Fanini
- Consumable and Process Improvement for Large Copper Wire BondingTao XuTodd WalkerBernard PonceletJason FuChristoph Luechinger
- PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONSKeith BestSteve GardnerCasey Donaher
- Evaluating the Effect of SMT Material & Process Variables on Voiding Under QFNsBrandon JuddMaria Durham
- Behaviors of QFN Packages on a Leadframe StripEric OuyangBilly AhnSeng Guan ChowAnonuevo DexterSeonMo GuYongHyuk JeongJaeMyong Kim
- Characterizing and solving imaging challenges in thick resists for wafer and panel based lithography applicationsJames E. WebbRoger McCleary
- Glass 3D Solenoid Inductors IPD Substrate Manufacturing Assembly and CharacterizationChun-Hsien ChienYu-Hua ChenYu-Chung HsiehWei-Ti LinChien-Chou ChenDyi-Chung HuTzvy-Jang TsengRavi Shenoy
- Effects of Silicon Wafer Bump Pad Structures on Solder and Cu Pillar Flip-Chip ReliabilityShirley AsoyScott ExonLiping ZhuPeter MoonMichael CarrollShannon Pan
- Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging ApplicationsXin ZhaoK. JagannadhamWuttichai ReainthippayasakulMichael. T. LanaganDouglas C. Hopkins
- Performance Comparison of High Temperature Pt-Based Sensor Using Pt Core-Shell Powder and PasteRichard StephensonKyle BandaccariHoward Imhof
- Ultra-thin glasses for semiconductor packagingRuediger SprengardMatthias JotzMartin LetzLutz ParthierFredrik PrinceMarkus WoehrmannJ.-U. ThomasMichael Toepper
- New Low Temperature Alloy Core-Shell Structures for Joining ApplicationsRichard StephensonKyle BandaccariHoward Imhof
- Silicon based cell sorting device: Fabrication, characterization and applicationsBivragh MajeedChengxun LiuErik SohnLut Van AckerKoen De WijsDeniz SabuncuogluLiesbet Lagae
- Fire Damage and Repair Techniques for Flash Memory Modules: Implication for Post-Crash InvestigationsPreeth SivakumarJack P. LombardiStephen R. CainMark PoliksJames CashJoseph GregorMichael Budinski
- Digital Manufacturing and Performance Testing for Military Grade Application Specific Electronic Packaging (ASEP)C. Mike NewtonPaul I. DeffenbaughKenneth H. ChurchNathan B. CraneClayton Neff
- New ferrimagnetic garnets for LTCC-technology circulatorsLilia QassymGérard CibienRichard LebourgeoisGilles MartinDorothée Colson
- Correlation of Through-silicon Via (TSV) Dimension Scaling to TSV Stress and Reliability for 3D InterconnectsLaura SpinellaJang-Hi ImPaul S. HoTengfei Jiang
- Alternative Metallurgies for MEMS Lid SealCatherine Shearer
- Pre-applied inter chip fill material for 3D chip stack integration – How to improve bonding quality and reliabilityKan TakeshitaMakoto IkemotoMasaya SugiyamaHidehiro YamamotoHideki KiritaniJun-Wei ShenTetsuharu YugeHiroya KodamaYasuhiro Kawase
- Optical Role of Die Bonding for Chip-on-Board White Light Emitting Diode EmittersGunwoo KimYu-Chou ShihFrank Shi
- PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITSCenk AtalanTaylan Eker
- 3D TSV-based Inductor Design for a Secure Internet of ThingsBruce KimSang-Bock Cho
- A deeper understanding on the motion behaviors of wire during ultrasonic wedge-wedge bonding processYangyang LongFolke DenckerMarc WurzArmin FeldhoffJens Twiefel
- Plasma Activated Bonding for an Enhanced Alignment Electrostatic LensElham Vakil AsadollaheiManuel Gamero-Castaño
- The Impact of Stencil Printing Upon Assembly & Reliability Of 0.3mm Pitch CSP ComponentsMark WhitmoreJeff Schake
- Proposal of Ultra-fine and High Reliable Trench Wiring Process for Organic InterposerKazuyuki MitsukuraMasaya TobaKousuke UrashimaYoshinori EjiriKenichi IwashitaTomonori MinegishiKazuhiko Kurafuchi
- Novel glass substrates for minimizing thermal stress development during electronic device packaging processShuhei NomuraShigeki SawamuraYu HanawaYusuke SakaiKazutaka HayashiLtd. Asahi Glass Co.
- Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects.Adeel BajwaNiteesh MaratheSivaChandra JangamSaptadeep PalPing-Yu LiuMark GoorskySubramanian S. Iyer
- Measuring Die Tilt Using Shadow Moiré Optical Measurements; New Techniques for Discontinuous and Semi-Reflective SurfacesNeil Hubble
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Wright, Daniel Nilsen, Branson D. Belle, Kari Schjølberg-Henriksen, Hoang-Vu Nguyen, Jakob Gakkestad, Helge Kristiansen, and Maaike M. Visser Taklo. 2016. “Anisotropic Conductive Film for Fine-Pitch Interconnects.” IMAPSource Proceedings 2016 (1): 44–49. https://doi.org/10.4071/isom-2016-TP23.