ISSN 2380-4505
Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications
Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications
Zhao, Xin, K. Jagannadham, Wuttichai Reainthippayasakul, Michael. T. Lanagan, and Douglas C. Hopkins. 2016. “Thermal and Electrical Characterizations of Ultra-Thin Flexible 3YSZ Ceramic for Electronic Packaging Applications.” IMAPSource Proceedings 2016 (1): 391–96. https://doi.org/10.4071/isom-2016-THA13.