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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Addressing Next Generation Packaging and IoT with Glass Solutions

Aric Shorey, Rachel Lu, Kevin Adriance, Gene Smith,
Glassthrough glass via (TGV)panelInternet of things (IoT)
https://doi.org/10.4071/isom-2016-WP21
IMAPSource Conference Papers
Shorey, Aric, Rachel Lu, Kevin Adriance, and Gene Smith. 2016. “Addressing Next Generation Packaging and IoT with Glass Solutions.” IMAPSource Proceedings 2016 (1): 277–81. https:/​/​doi.org/​10.4071/​isom-2016-WP21.
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