ISSN 2380-4505
Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability
Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability
Articles in Vol. 2019, Issue 1, 2019
Vol. 2019, Issue 1, 2019
- Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power ElectronicsEvan A. HuenersRichard D. HuenersAnthony D. F. O' SullivanM. Redzuan Zin
- Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnectionChun-Hsien ChienChien-Chou ChenWen-Liang YehWei-Ti LinCheng-Hui WuFu-Yang ChenYi-Cheng LinPo-Chiang WangJeng-Ting LiBo Cheng LinYu-Hua ChenTzyy-Jang Tseng
- Package Voltage Regulators: The Answer for Power Management ChallengesJoseph MeyerReza MoghimiNoah Sturcken
- High bond reliability of newly developed silver alloy bonding wireNoritoshi ArakiMotoki EtoTakumi OhkabeTeruo HaibaraTakashi YamadaTetsuya OyamadaTomohiro Uno
- Failure Analysis of Interconnection Fault in a PoP Module Applied for Mobile PhoneHui XiaoWei LiGaoming Shi
- Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field StudyT. BernhardL. GregoriadesS. BranaganL. StampE. SteinhäuserR. SchulzF. Brüning
- Evaluation of die to organic laminate to PCB interconnects up to 50GHzSelaka BulumullaKoushik Ramachandran
- On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°CJessica RichterAnna SteenmannBenjamin SchellscheidtThomas Licht
- First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave ApplicationsNobuo OguraSiddharth RavichandranTailong ShiAtom WatanabeShuhei YamadaMohanalingam KathaperumalRao Tummala
- COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELINGJonas StrobeltJoerg BauerMarc DreissigackerOle HoelckTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- Bumping Co-planarity Collocation for Different UBM Size by Geometry IntegrationWei-Wei (Xenia) LiuBerdy WengLu-Ming LaiKuang-Hsiung Chen
- Semiconductor manufacturing strategy: Where in the world to locate a fab or cleanroom?Stephen M. Rothrock
- How to secure the fabrication of Gallium Nitride on Si wafersD. AlliataN. AndersonM. Durand de GevigneyI. BergoendP. Gastaldo
- Laser Etching of Gold Conductors for RF ApplicationsStephanie EdwardsRyan PersonsSteve FelthamJeff HowertonGeoffrey LottDaniel Macko
- LTCC slot array antenna for 5G applicationHiroyuki TakahashiSatoshi HiranoDaisuke Yamashita
- Advanced Package Design: Inter-Domain Design MethodologiesBill AcitoEngineer IC Packaging Product
- Advanced Fiber Optic and Ultrasonic Sensor Systems for Structural Health Monitoring of Pipes in Nuclear Waste SitesAparna AravelliMichael ThompsonDwayne McDanielMathew KrutchMike McNeillyKen ImrichBruce Wiersma
- Advances in Hermetic Projection Weld SealingTom Salzer
- Cu Core Column Application for Fine Pitch 3D MountingHiroki SUDODaisuke SOMAHiroshi OKADA
- Assembly challenges with Flip Chip multi-die and interposer-based SiP ModulesAkhilesh K SinghKevin M SullivanGeorge R LealTony Gong
- Study to Lower Cu Pillar Flip-Chip Failure RateBong RosarioJoseph HolyoakMohsen Haji-RahimGene LambirdYong WangKendra LyonsTodd JohnsonPaul MakowenskyjBrian MyersShannon Pan
- Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated TestingE. SuhirS. YiJ. Nicolics
- Deformable Interconnects with Embedded Devices in Flexible Fan-Out PackagesSk Yeahia Been SayeedDaniel WildingJose Solis CamaraDieff VitalShubhendu BhardwajP. M Raj
- Contact Electroplating Technology (CET)Igor V. Kadija
- System I/O Optimization with SoC, SiP, PCB Co-DesignLance Wang
- Development of EDA Techniques for Power Module EMI Modeling and Layout OptimizationTristan M. EvansQuang LeBalaji NarayanasamyYarui PengFang LuoH. Alan Mantooth
- Controlling Surface Sensitive Processes in Microelectronics Manufacturing to Improve Wire Bonded Joint ReliabilityE.J. KiddBrooke CampbellR. Giles Dillingham
- A New Halogen-Free Parylene for High Performance & Reliability of Microelectronics in Harsh EnvironmentsRakesh KumarFrank KeDustin EnglandAngie SummersLamar Young
- High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding ApplicationsYuan ZhaoDoug KatzeJohn WoodBruno TollaHoward Yun
- Mechanical Modeling and Continuous Process ImprovementShane D. HarkerMercedes T. HernandezGene Lambird
- A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallizationSri Krishna BhogarajuOmid MokhtariJacopo PascucciFosca ContiHiren R KotadiaGordon Elger
- Highly Miniaturized Integrated Sensor Nodes for Industry 4.0S. VogesK.-F. BeckerD. SchützeB. SchröderP. FruehaufM. HeimannS. NerreterR. BlankS. GottwaldA. HofmeisterM. SchmiedM. KreitmairR. FustW. NeiferT. BraunT. ThomasM. Schneider-RamelowK.-D. Lang
- Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patternsTae Yeob KangDonghwan SeoYongchan ParkJoonki MinTaek-Soo Kim
- Development of Backside Buried Metal Layer Technology for 3D-ICsNaoya WatanabeYuuki AragaHaruo ShimamotoKatsuya KikuchiMakoto Nagata
- A Study on Reduced/Absent Adhesion/Cap Layers for Optimized BEOL RC PerformanceDewei XuZhiguo SunHaojun ZhangScott PozderPatrick JustisonSeung-Yeop KookRod AugurRobert Fox
- Cu pillar bump development for 7nm Chip package interaction (CPI) technologyLei FuMilind BhagavatCheryl SelvanayagamKen LeongIvor Barber
- Optimal Lid Design Parameters for Reducing Warpage of Flip-chip PackagePriyal ShahMilind Bhagavat
- Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional ReflowVarun SomanVikram VenkatadriMark D. Poliks
- Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation PackagingRalf Schmidt
- Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded SolderTakashi HisadaToyohiro AokiEiji NakamuraSayuri KoharaHiroyuki Mori
- Control of Solder Bump Growing Morphology in Lead Free PlatingBerdy WengWei-Wei (Xenia) LiuLu-Ming LaiKuang-Hsiung Chen
- Advanced Die Saw Technology for WLCSP Reliability EnhancementChing Chia ChenYu-Po WangJensen TsaiHsin Long Chen
- Recent Advances in X-ray for Semicon ApplicationsKeith BryantRagnar Vaga
- Passive Die Alignment in Glass Embedded Fan-Out PackagingRoman OstholtRafael SantosNorbert AmbrosiusDaniel DunkerJean-Pol Delrue
- Strain Rate Sensitivity of Mixed SAC-SnBi Solder JointsLuke A. WentlentJames WilcoxXuanyi Ding
- Ferrites in Transfer Molded Power SiPs – Challenges in PackagingTina ThomasMarius van DijkMarc DreissigackerStefan HoffmannHans WalterKarl-Friedrich BeckerMartin Schneider-Ramelow
- 4-2-4 Laminate hotspot identification and joule heating effect assessment via thermoelectrical simulationZhi YangKathryn C. RiveraJanak PatelEric TrembleDavid B. StoneKwang Won ChoiEdmund Blackshear
- Prospects for automotive SiP modules applying IC assembly and packaging technologyTomohiro FurukawaTakahiro KasugaMasato UmeharaYuka Tamadate
- A Study of Defects in High Reliability Die Sort ApplicationsSarah Parrish
- Reliability of screen-printed conductors and resistors during fatigue cycling on flexible substrateBehnam GarakaniK Udara Sandakelum SomarathnaDarshana L WeerawarneMark D PoliksAzar Alizadeh
- A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-FilmKenta FurunoShigeyuki YamashitaYoji WakayamaNaoya SaikiShinya Takyu
- Ultra-Thin Wafer-Level Chip Scale PackagingDouglas HacklerDale WilsonEdward Prack
- Control of Void Formation in Adhesively Bonded JointsNina S. DytiukThomas F. MarinisJoseph W. Soucy
- Low-Density Fan-Out Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI SwitchRameen HadizadehAnssi LaitinenNiko KuusniemiVolker BlaschkeDavid MolineroEoin O'TooleMárcio Pinheiro
- Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in ApplicationsDave SaumsTim JensenCarol GowansSeth HomerRon Hunadi
- Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization step in Interposers and RDL fabrication process for 3D IC stackingAmit KumarJose ChaconPeter GelzinisAnkineedu Velaga
- Innovative Panel Plating for Heterogeneous IntegrationRichard BoulangerJon HanderRobert Moon
- Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging TechnologyChristopher KapustaLiang YinKaustubh NagarkarAnisha WalwaikarKrishnaswami Srihari
- A Wirebonding Instrument for Insulated and Coaxial WiresMitchell MeinholdCaprice GrayJeffery DelisioErnest KimChristian WellsDaniela TorresPeter LewisDavid Hagerstrom
- Reliability of printed wire bondsC. Marsan-LoyerC. Sansregret
- Design and Fabrication of 3D Printed Reconfigurable Metamaterial-inspired StructuresSaranraj KaruppuswamiAvi Rajendra-NicolucciSaikat MondalMohd Ifwat Mohd GhazaliPremjeet Chahal
- Designing Software Configurable Chips and SIPs using Chiplets and zGlueJawad NasrullahZhiquan LuoGreg Taylor
- Low thermal resistance packaging for high power electronicsNagaraja ShashidharAbhijit Rao
- Package Qualification Envelope for 22FDX® TechnologyChristian KlewerFrank KuechenmeisterJens PaulDirk BreuerBjoern BoehmeJae Kyu ChoSimone CapecchiMichael Thiele
- Low Loss Photodielectric Materials for 5G HS/HF ApplicationsColin O. HayesKevin WangRosemary BellColin CalabreseJeff KongJennie PaikLingyun WeiKirk ThompsonMichael GallagherRobert K. Barr
- Controlling Extrinsic Chloride Ions Effect on Copper Wirebond ReliabilitySheila F ChopinVarughese Mathew
- Development of High Thermally Conductive Die Attach for TIM ApplicationsMaciej PatelkaSho IkedaKoji SasakiHiroki MyodoNortisuka Mizumura
- A Miniaturized Dual Band Antenna for Harmonic RFID TagSaikat MondalSaranraj KaruppuswamiDeepak KumarAmanpreet KaurPremjeet Chahal
- Flip Chip Underfill RF CharacterizationRobert B. PaulA. Ege EnginJerry Aguirre
- A Flexible Down-Converter for Satellite Communication in the Ka-BandPeter UhligReinhard KulkeCarsten GünnerJürgen KassnerGregor Möllenbeck
- Automated Optical Inspection (AOI) for FOPLP with Simultaneous Die Placement MetrologyBurhan AliMike Marshall
- Process advantages of thermosonic wedge-wedge bonding using dosed tool heatingMatthias HunstigAndreas UngerMichael BrökelmannHans J. Hesse
- Thin-film based passive RFID sensor tag for detection of packaged food volatilesSaranraj KaruppuswamiSaikat MondalDeepak KumarAmanpreet KaurPremjeet Chahal
- Characterization and Electrical Performance of Glass Diplexer ModulesCharles WoychikJohn LaufferScott PollardRaj ParmarMichael GaigeWilliam WilsonJames CareyMatthew NeelyFeng LingLijun Chen
- New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid BondingYasuhisa KayabaYuzo NakamuraJun KamadaKazuo Kohmura
- Evaluation of Reliability of Lead-free Solders in Silver-free HybridsZhenzhen ShenAleksey Reiderman
- Analysis on Signal and Power Integrity of 2.3D Structure Organic PackageKosuke TsukamotoAtsunori KajikiYuji KunimotoMasayuki MizunoManabu NakamuraShinji NakazawaToshinori Koyama
- Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic GraphiteRiya PaulAmol DeshpandeFang Luo
- Development of Low Dk and Df polyimides for 5G applicationDaisaku MatsukawaNaoto NagamiKohei MizunoNobuyuki SaitoTetsuya EnomotoTakeharu Motobe
- Thin Glass Substrates with Through-Glass Vias.Aric ShoreyShelby NelsonDavid LevyPaul Ballentine
- An EMI Suppression Method in SiC Half-bridge Power Module DesignZhiwei WangChi ZhangYiyang YanCai ChenYong Kang
- Low Profile and Large Size WLCSP in IoT ApplicationsTom TangKuei Hsiao KuoVictor LinKelly ChenJ.Y. ChenB.H. MaYu-Po Wang
- Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDsShubhendu BhardwajS K Yeahia Been SayeedJose Solis CamaraDieff VitalP. M. Raj
- Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D StackingM. MehendaleL. HouR. MairM. KotelyanskiiM. LiebensJ. DerakhshandehP. MukundhanA. MillerE. BeyneT. Kryman
- “Drop-in” Conventional Reflow Oven Sinter-Able Pressure-Less Silver Paste for Die-Attach Assembly Mass ProductionSihai ChenEvan WernickiSara WrightChristine LaBarberaNing-Cheng Lee
- How Relevant is Packaging for 5G?Ivan NdipMichael TöpperKlaus-Dieter Lang
- FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLYRunsheng MaoFen ChenNing-Cheng Lee
- Reliability analysis of bonding wire based on stacked substrate packaging structureChi ZhangYifan TanZhizhao HuangCai ChenYong Kang
- The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability RequirementsJie ZhengYabing ZouYing YangJianghua ShenYingjie Zhang
- Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission PropertyMasaya TobaShuji NomotoNobuhito KomuroKazuyuki MitsukuraShinichiro AbeTakashi MasukoKazuhiko Kurafuchi
- A Novel Fabrication Process for High Density Silicon Capacitors by using Metal-Assisted Chemical EtchingSusumu ObataMitsuo SanoKazuo ShimokawaKazuhito Higuchi
- Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad PackagesAlvin DenoyoDarwin De LazoIvan CostaAllen Menor
- IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATIONWoo Han YoungMike Marshall
- Hydrophobic sealing materials for harsh environmental electrical connector package applicationsHua XiaNelson SettlesDavid DeWire
- Dust and Water Resistance Testing Methodology for Environmental SensorsS. KummerlD. MantleN. PatelR. MunjeP. Chen
- Quasi-Half Loop Bond Wire Antennas for Emerging Wireless Communication and Radar Sensor SystemsIvan NdipThi Huyen LeMartin Schneider-RamelowKlaus-Dieter Lang
- Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?Greg Caswell
- Flip-Chip Flux EvolutionAndy MackieHyoryoon JoSze Pei Lim
- THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULESReece WhittDavid Huitink
- A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging StructureZhiwei WangChi ZhangZhizhao HuangCai ChenFang Luo
- Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bondingReinhard SchemmelFlorian EacockCollin DymelTobias HemselMatthias HunstigMichael BrökelmannWalter Sextro
- Laser Sintering of Aerosol Jet Printed Interconnects on Flexible SubstrateMohammed AlhendiLudovico CestarolloGurvinder S. KhindaDarshana L. WeerawarneMark D. Poliks
- Three-Dimensional Thermal Modeling and Management of System on Package with Gold and Nano Based MaterialBe-nazir Khan
Chopin, Sheila F, and Varughese Mathew. 2019. “Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability.” IMAPSource Proceedings 2019 (1): 95–99. https://doi.org/10.4071/2380-4505-2019.1.000095.