Control of Solder Bump Growing Morphology in Lead Free Plating

Berdy Weng; Wei-Wei (Xenia) Liu; Lu-Ming Lai; Kuang-Hsiung Chen

doi:10.4071/2380-4505-2019.1.000488

Weng, Berdy, Wei-Wei (Xenia) Liu, Lu-Ming Lai, and Kuang-Hsiung Chen. 2019. “Control of Solder Bump Growing Morphology in Lead Free Plating.” IMAPSource Proceedings 2019 (1): 488–91. https://doi.org/10.4071/2380-4505-2019.1.000488.

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