ISSN 2380-4505
Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Advanced Package Design: Inter-Domain Design Methodologies
Advanced Package Design: Inter-Domain Design Methodologies
Articles in Vol. 2019, Issue 1, 2019
Vol. 2019, Issue 1, 2019
- Energy and Eco-Sustainability using Pressure-less Silver Sintering for RF Power ElectronicsEvan A. HuenersRichard D. HuenersAnthony D. F. O' SullivanM. Redzuan Zin
- Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnectionChun-Hsien ChienChien-Chou ChenWen-Liang YehWei-Ti LinCheng-Hui WuFu-Yang ChenYi-Cheng LinPo-Chiang WangJeng-Ting LiBo Cheng LinYu-Hua ChenTzyy-Jang Tseng
- Package Voltage Regulators: The Answer for Power Management ChallengesJoseph MeyerReza MoghimiNoah Sturcken
- High bond reliability of newly developed silver alloy bonding wireNoritoshi ArakiMotoki EtoTakumi OhkabeTeruo HaibaraTakashi YamadaTetsuya OyamadaTomohiro Uno
- Failure Analysis of Interconnection Fault in a PoP Module Applied for Mobile PhoneHui XiaoWei LiGaoming Shi
- Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field StudyT. BernhardL. GregoriadesS. BranaganL. StampE. SteinhäuserR. SchulzF. Brüning
- Evaluation of die to organic laminate to PCB interconnects up to 50GHzSelaka BulumullaKoushik Ramachandran
- On-Chip Diffusion Bonding creates Stable Interconnections Usable at Temperatures over 300°CJessica RichterAnna SteenmannBenjamin SchellscheidtThomas Licht
- First Demonstration of Ultra-Thin Glass Panel Embedded (GPE) Package with Sheet Type Epoxy Molding Compound for 5G/mm-wave ApplicationsNobuo OguraSiddharth RavichandranTailong ShiAtom WatanabeShuhei YamadaMohanalingam KathaperumalRao Tummala
- COMBINING ADVANTAGES OF RHEOMETRY AND INLINE VISCOMETRY FOR IMPROVED VISCOSITY MODELINGJonas StrobeltJoerg BauerMarc DreissigackerOle HoelckTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- Bumping Co-planarity Collocation for Different UBM Size by Geometry IntegrationWei-Wei (Xenia) LiuBerdy WengLu-Ming LaiKuang-Hsiung Chen
- Semiconductor manufacturing strategy: Where in the world to locate a fab or cleanroom?Stephen M. Rothrock
- How to secure the fabrication of Gallium Nitride on Si wafersD. AlliataN. AndersonM. Durand de GevigneyI. BergoendP. Gastaldo
- Laser Etching of Gold Conductors for RF ApplicationsStephanie EdwardsRyan PersonsSteve FelthamJeff HowertonGeoffrey LottDaniel Macko
- LTCC slot array antenna for 5G applicationHiroyuki TakahashiSatoshi HiranoDaisuke Yamashita
- Advanced Package Design: Inter-Domain Design MethodologiesBill AcitoEngineer IC Packaging Product
- Advanced Fiber Optic and Ultrasonic Sensor Systems for Structural Health Monitoring of Pipes in Nuclear Waste SitesAparna AravelliMichael ThompsonDwayne McDanielMathew KrutchMike McNeillyKen ImrichBruce Wiersma
- Advances in Hermetic Projection Weld SealingTom Salzer
- Cu Core Column Application for Fine Pitch 3D MountingHiroki SUDODaisuke SOMAHiroshi OKADA
- Assembly challenges with Flip Chip multi-die and interposer-based SiP ModulesAkhilesh K SinghKevin M SullivanGeorge R LealTony Gong
- Study to Lower Cu Pillar Flip-Chip Failure RateBong RosarioJoseph HolyoakMohsen Haji-RahimGene LambirdYong WangKendra LyonsTodd JohnsonPaul MakowenskyjBrian MyersShannon Pan
- Solder Joint Interconnections in Automotive Electronics: Design-for-Reliability and Accelerated TestingE. SuhirS. YiJ. Nicolics
- Deformable Interconnects with Embedded Devices in Flexible Fan-Out PackagesSk Yeahia Been SayeedDaniel WildingJose Solis CamaraDieff VitalShubhendu BhardwajP. M Raj
- Contact Electroplating Technology (CET)Igor V. Kadija
- System I/O Optimization with SoC, SiP, PCB Co-DesignLance Wang
- Development of EDA Techniques for Power Module EMI Modeling and Layout OptimizationTristan M. EvansQuang LeBalaji NarayanasamyYarui PengFang LuoH. Alan Mantooth
- Controlling Surface Sensitive Processes in Microelectronics Manufacturing to Improve Wire Bonded Joint ReliabilityE.J. KiddBrooke CampbellR. Giles Dillingham
- A New Halogen-Free Parylene for High Performance & Reliability of Microelectronics in Harsh EnvironmentsRakesh KumarFrank KeDustin EnglandAngie SummersLamar Young
- High Temperature and High Reliability Performance of Electrically Conductive Film Adhesives for RF Grounding ApplicationsYuan ZhaoDoug KatzeJohn WoodBruno TollaHoward Yun
- Mechanical Modeling and Continuous Process ImprovementShane D. HarkerMercedes T. HernandezGene Lambird
- A multi-pronged approach to low-pressure Cu sintering using surface-modified particles, substrate and chip metallizationSri Krishna BhogarajuOmid MokhtariJacopo PascucciFosca ContiHiren R KotadiaGordon Elger
- Highly Miniaturized Integrated Sensor Nodes for Industry 4.0S. VogesK.-F. BeckerD. SchützeB. SchröderP. FruehaufM. HeimannS. NerreterR. BlankS. GottwaldA. HofmeisterM. SchmiedM. KreitmairR. FustW. NeiferT. BraunT. ThomasM. Schneider-RamelowK.-D. Lang
- Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patternsTae Yeob KangDonghwan SeoYongchan ParkJoonki MinTaek-Soo Kim
- Development of Backside Buried Metal Layer Technology for 3D-ICsNaoya WatanabeYuuki AragaHaruo ShimamotoKatsuya KikuchiMakoto Nagata
- A Study on Reduced/Absent Adhesion/Cap Layers for Optimized BEOL RC PerformanceDewei XuZhiguo SunHaojun ZhangScott PozderPatrick JustisonSeung-Yeop KookRod AugurRobert Fox
- Cu pillar bump development for 7nm Chip package interaction (CPI) technologyLei FuMilind BhagavatCheryl SelvanayagamKen LeongIvor Barber
- Optimal Lid Design Parameters for Reducing Warpage of Flip-chip PackagePriyal ShahMilind Bhagavat
- Understanding the Effects of Process Parameters to Compensate for Substrate Warpage in Chip on Flex (CoF) Assembly Using Conventional ReflowVarun SomanVikram VenkatadriMark D. Poliks
- Optimized ECD Cu RDL Process with Via Filling Capability for Next Generation PackagingRalf Schmidt
- Flip Chip Joining with Quaternary Low Melting Temperature Solder Bump Fabricated with Injection Molded SolderTakashi HisadaToyohiro AokiEiji NakamuraSayuri KoharaHiroyuki Mori
- Control of Solder Bump Growing Morphology in Lead Free PlatingBerdy WengWei-Wei (Xenia) LiuLu-Ming LaiKuang-Hsiung Chen
- Advanced Die Saw Technology for WLCSP Reliability EnhancementChing Chia ChenYu-Po WangJensen TsaiHsin Long Chen
- Recent Advances in X-ray for Semicon ApplicationsKeith BryantRagnar Vaga
- Passive Die Alignment in Glass Embedded Fan-Out PackagingRoman OstholtRafael SantosNorbert AmbrosiusDaniel DunkerJean-Pol Delrue
- Strain Rate Sensitivity of Mixed SAC-SnBi Solder JointsLuke A. WentlentJames WilcoxXuanyi Ding
- Ferrites in Transfer Molded Power SiPs – Challenges in PackagingTina ThomasMarius van DijkMarc DreissigackerStefan HoffmannHans WalterKarl-Friedrich BeckerMartin Schneider-Ramelow
- 4-2-4 Laminate hotspot identification and joule heating effect assessment via thermoelectrical simulationZhi YangKathryn C. RiveraJanak PatelEric TrembleDavid B. StoneKwang Won ChoiEdmund Blackshear
- Prospects for automotive SiP modules applying IC assembly and packaging technologyTomohiro FurukawaTakahiro KasugaMasato UmeharaYuka Tamadate
- A Study of Defects in High Reliability Die Sort ApplicationsSarah Parrish
- Reliability of screen-printed conductors and resistors during fatigue cycling on flexible substrateBehnam GarakaniK Udara Sandakelum SomarathnaDarshana L WeerawarneMark D PoliksAzar Alizadeh
- A Novel Dicing tape for WLCSP Using Stealth Dicing Through Dicing tape and Back Side Protection-FilmKenta FurunoShigeyuki YamashitaYoji WakayamaNaoya SaikiShinya Takyu
- Ultra-Thin Wafer-Level Chip Scale PackagingDouglas HacklerDale WilsonEdward Prack
- Control of Void Formation in Adhesively Bonded JointsNina S. DytiukThomas F. MarinisJoseph W. Soucy
- Low-Density Fan-Out Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI SwitchRameen HadizadehAnssi LaitinenNiko KuusniemiVolker BlaschkeDavid MolineroEoin O'TooleMárcio Pinheiro
- Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in ApplicationsDave SaumsTim JensenCarol GowansSeth HomerRon Hunadi
- Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization step in Interposers and RDL fabrication process for 3D IC stackingAmit KumarJose ChaconPeter GelzinisAnkineedu Velaga
- Innovative Panel Plating for Heterogeneous IntegrationRichard BoulangerJon HanderRobert Moon
- Thermal Modeling and Experimental Analysis of High Power LED using POL-kw Packaging TechnologyChristopher KapustaLiang YinKaustubh NagarkarAnisha WalwaikarKrishnaswami Srihari
- A Wirebonding Instrument for Insulated and Coaxial WiresMitchell MeinholdCaprice GrayJeffery DelisioErnest KimChristian WellsDaniela TorresPeter LewisDavid Hagerstrom
- Reliability of printed wire bondsC. Marsan-LoyerC. Sansregret
- Design and Fabrication of 3D Printed Reconfigurable Metamaterial-inspired StructuresSaranraj KaruppuswamiAvi Rajendra-NicolucciSaikat MondalMohd Ifwat Mohd GhazaliPremjeet Chahal
- Designing Software Configurable Chips and SIPs using Chiplets and zGlueJawad NasrullahZhiquan LuoGreg Taylor
- Low thermal resistance packaging for high power electronicsNagaraja ShashidharAbhijit Rao
- Package Qualification Envelope for 22FDX® TechnologyChristian KlewerFrank KuechenmeisterJens PaulDirk BreuerBjoern BoehmeJae Kyu ChoSimone CapecchiMichael Thiele
- Low Loss Photodielectric Materials for 5G HS/HF ApplicationsColin O. HayesKevin WangRosemary BellColin CalabreseJeff KongJennie PaikLingyun WeiKirk ThompsonMichael GallagherRobert K. Barr
- Controlling Extrinsic Chloride Ions Effect on Copper Wirebond ReliabilitySheila F ChopinVarughese Mathew
- Development of High Thermally Conductive Die Attach for TIM ApplicationsMaciej PatelkaSho IkedaKoji SasakiHiroki MyodoNortisuka Mizumura
- A Miniaturized Dual Band Antenna for Harmonic RFID TagSaikat MondalSaranraj KaruppuswamiDeepak KumarAmanpreet KaurPremjeet Chahal
- Flip Chip Underfill RF CharacterizationRobert B. PaulA. Ege EnginJerry Aguirre
- A Flexible Down-Converter for Satellite Communication in the Ka-BandPeter UhligReinhard KulkeCarsten GünnerJürgen KassnerGregor Möllenbeck
- Automated Optical Inspection (AOI) for FOPLP with Simultaneous Die Placement MetrologyBurhan AliMike Marshall
- Process advantages of thermosonic wedge-wedge bonding using dosed tool heatingMatthias HunstigAndreas UngerMichael BrökelmannHans J. Hesse
- Thin-film based passive RFID sensor tag for detection of packaged food volatilesSaranraj KaruppuswamiSaikat MondalDeepak KumarAmanpreet KaurPremjeet Chahal
- Characterization and Electrical Performance of Glass Diplexer ModulesCharles WoychikJohn LaufferScott PollardRaj ParmarMichael GaigeWilliam WilsonJames CareyMatthew NeelyFeng LingLijun Chen
- New Thin Adhesive for High Density 2.5D Heterogeneous Device Integration with Cu-Cu Hybrid BondingYasuhisa KayabaYuzo NakamuraJun KamadaKazuo Kohmura
- Evaluation of Reliability of Lead-free Solders in Silver-free HybridsZhenzhen ShenAleksey Reiderman
- Analysis on Signal and Power Integrity of 2.3D Structure Organic PackageKosuke TsukamotoAtsunori KajikiYuji KunimotoMasayuki MizunoManabu NakamuraShinji NakazawaToshinori Koyama
- Thermal Decoupling in Power Electronics Modules Using Thermal Pyrolytic GraphiteRiya PaulAmol DeshpandeFang Luo
- Development of Low Dk and Df polyimides for 5G applicationDaisaku MatsukawaNaoto NagamiKohei MizunoNobuyuki SaitoTetsuya EnomotoTakeharu Motobe
- Thin Glass Substrates with Through-Glass Vias.Aric ShoreyShelby NelsonDavid LevyPaul Ballentine
- An EMI Suppression Method in SiC Half-bridge Power Module DesignZhiwei WangChi ZhangYiyang YanCai ChenYong Kang
- Low Profile and Large Size WLCSP in IoT ApplicationsTom TangKuei Hsiao KuoVictor LinKelly ChenJ.Y. ChenB.H. MaYu-Po Wang
- Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDsShubhendu BhardwajS K Yeahia Been SayeedJose Solis CamaraDieff VitalP. M. Raj
- Non-destructive In-line IMC Thickness Measurement Using Acoustic Metrology for 3D StackingM. MehendaleL. HouR. MairM. KotelyanskiiM. LiebensJ. DerakhshandehP. MukundhanA. MillerE. BeyneT. Kryman
- “Drop-in” Conventional Reflow Oven Sinter-Able Pressure-Less Silver Paste for Die-Attach Assembly Mass ProductionSihai ChenEvan WernickiSara WrightChristine LaBarberaNing-Cheng Lee
- How Relevant is Packaging for 5G?Ivan NdipMichael TöpperKlaus-Dieter Lang
- FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLYRunsheng MaoFen ChenNing-Cheng Lee
- Reliability analysis of bonding wire based on stacked substrate packaging structureChi ZhangYifan TanZhizhao HuangCai ChenYong Kang
- The Case of Failure Analysis of the PCBA Wire Corrosion under High Reliability RequirementsJie ZhengYabing ZouYing YangJianghua ShenYingjie Zhang
- Semi-additive Process Based Cu Wirings with Ultra Smooth Electroless Cu Seed Layer and Important Factor for High Frequency Transmission PropertyMasaya TobaShuji NomotoNobuhito KomuroKazuyuki MitsukuraShinichiro AbeTakashi MasukoKazuhiko Kurafuchi
- A Novel Fabrication Process for High Density Silicon Capacitors by using Metal-Assisted Chemical EtchingSusumu ObataMitsuo SanoKazuo ShimokawaKazuhito Higuchi
- Package Reliability and Integrity Improvements for a Thermally Enhance Non-Conductive Die Attach Adhesive for ASIC Devices on Exposed Pad PackagesAlvin DenoyoDarwin De LazoIvan CostaAllen Menor
- IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATIONWoo Han YoungMike Marshall
- Hydrophobic sealing materials for harsh environmental electrical connector package applicationsHua XiaNelson SettlesDavid DeWire
- Dust and Water Resistance Testing Methodology for Environmental SensorsS. KummerlD. MantleN. PatelR. MunjeP. Chen
- Quasi-Half Loop Bond Wire Antennas for Emerging Wireless Communication and Radar Sensor SystemsIvan NdipThi Huyen LeMartin Schneider-RamelowKlaus-Dieter Lang
- Can Electrolytic Capacitors Meet the Demands of High Reliability Applications?Greg Caswell
- Flip-Chip Flux EvolutionAndy MackieHyoryoon JoSze Pei Lim
- THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULESReece WhittDavid Huitink
- A High Performance Full SiC Power Module Based On a Novel Stacked DBCs Hybrid Packaging StructureZhiwei WangChi ZhangZhizhao HuangCai ChenFang Luo
- Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bondingReinhard SchemmelFlorian EacockCollin DymelTobias HemselMatthias HunstigMichael BrökelmannWalter Sextro
- Laser Sintering of Aerosol Jet Printed Interconnects on Flexible SubstrateMohammed AlhendiLudovico CestarolloGurvinder S. KhindaDarshana L. WeerawarneMark D. Poliks
- Three-Dimensional Thermal Modeling and Management of System on Package with Gold and Nano Based MaterialBe-nazir Khan
Acito, Bill, and Engineer IC Packaging Product. 2019. “Advanced Package Design: Inter-Domain Design Methodologies.” IMAPSource Proceedings 2019 (1): 284–88. https://doi.org/10.4071/2380-4505-2019.1.000284.