Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Cu pillar bump development for 7nm Chip package interaction (CPI) technology
Cu pillar bump development for 7nm Chip package interaction (CPI) technology
Fu, Lei, Milind Bhagavat, Cheryl Selvanayagam, Ken Leong, and Ivor Barber. 2019. “Cu Pillar Bump Development for 7nm Chip Package Interaction (CPI) Technology.” IMAPSource Proceedings 2019 (1): 176–82. https://doi.org/10.4071/2380-4505-2019.1.000176.