ISSN 2380-4505
Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief
Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief
Suhir, Ephraim, Sung Yi, Jennie S. Hwang, and R. Ghaffarian. 2018. “Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage Relief.” IMAPSource Proceedings 2018 (1): 534–42. https://doi.org/10.4071/2380-4505-2018.1.000534.