Understanding Mold Compound Behavior on Flip Chip QFN Packages

Ruby Ann M. Camenforte; Jason Colte; Richard Sumalinog; Sylvester Sanchez; Jaimal Williamson

doi:10.4071/2380-4505-2018.1.000125

Camenforte, Ruby Ann M., Jason Colte, Richard Sumalinog, Sylvester Sanchez, and Jaimal Williamson. 2018. “Understanding Mold Compound Behavior on Flip Chip QFN Packages.” IMAPSource Proceedings 2018 (1): 125–28. https://doi.org/10.4071/2380-4505-2018.1.000125.

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