This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:14330/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Fabrication of an advanced epoxy based molding compound with high thermal conductivity and outstanding mechanical properties

Nazila Dadvand, Mina Dadvand, Georges Kipouros,
epoxy based molding compoundthermal conductivitymechanical propertiesnovel moldingaluminum particlesresinaluminaultrasonic treatmenthydrogen peroxide
https://doi.org/10.4071/2380-4505-2018.1.000298
IMAPSource Conference Papers
Dadvand, Nazila, Mina Dadvand, and Georges Kipouros. 2018. “Fabrication of an Advanced Epoxy Based Molding Compound with High Thermal Conductivity and Outstanding Mechanical Properties.” IMAPSource Proceedings 2018 (1): 298–304. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000298.

View more stats

Powered by Scholastica, the modern academic journal management system