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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Low Dk and Df Photosensitive Insulation Material for Low Transmission Loss Packages

Shinichiro Abe, Kazuyuki Mitsukura, Yuki Imazu, Masaya Toba, Takashi Masuko, Kazuhiko Kurafuchi,
InterposerFan-out Package5GPhotosensitive insulation materialInsulation reliabilitylow Df
https://doi.org/10.4071/2380-4505-2018.1.000415
IMAPSource Conference Papers
Abe, Shinichiro, Kazuyuki Mitsukura, Yuki Imazu, Masaya Toba, Takashi Masuko, and Kazuhiko Kurafuchi. 2018. “Low Dk and Df Photosensitive Insulation Material for Low Transmission Loss Packages.” IMAPSource Proceedings 2018 (1): 415–18. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000415.
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