Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications
Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applications
Best, Keith, Ognian Dimov, Sudmun Habib, and Sanjay Malik. 2018. “Lithographic Evaluation of Thin Photoimageable Dielectric Dry Film for Advanced Panel Level Packaging Applications.” IMAPSource Proceedings 2018 (1): 361–64. https://doi.org/10.4071/2380-4505-2018.1.000361.