ISSN 2380-4505
Articles in Vol. 2018, Issue 1, 2018
Vol. 2018, Issue 1, 2018
- Optimization of Cupric Chloride Subtractive Etching for Cu High Density InterconnectsAlexander LambertGoutham IssacAshish SalunkeLuwen LuOliver Chyan
- A New Method for Non-Destructive Characterization of Through Holes in Printed Circuit BoardsSarah CzaplewskiJoe DomanJoe Kuczynski
- Explore High Bonding Reliability of Cu Wire Bonded Devices under Extreme Halide Contaminated EnvironmentsMuthappan AsokanJoshua CapertonAshish SalunkeOliver ChyanFei Xu
- Laser Power Supply Thermo-Structural Analysis for the Mars 2020 RoverJuan Cepeda-RizoDavid Tuman
- A numerical study on mitigation of flying dies in compression molding of microelectronic packagesMarc DreissigackerOle HoelckJoerg BauerTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- System Co-Design Modeling Methodology of a High Speed (25Gbps) Multi-Rate 4-Channel Retimer: Simulation to Measurement CorrelationTony TangBridger WrayRajen Murugan
- A comparison of the Cu electrochemical migration behavior between Cu lines with 5 um L/S realized by conventional Semi Additive Process (SAP) and an innovative Excimer Laser Damascene ProcessRobert GernhardtFriedrich MüllerMarkus WoehrmannHabib HichriKarin HauckMarkus ArendtKlaus-Dieter Lang
- Reliability of an Electronic Product Fabricated of Mass-Produced ComponentsE. Suhir
- Flip chip reliability and intermetallic compounds for SIP moduleAdrien MorardJean-Christophe RiouGabriel Pares
- Elevated Stand-Off Heights in Solder Joint Interconnections of Surface Mounted IC Packages Result in Appreciable Stress and Warpage ReliefEphraim SuhirSung YiJennie S. HwangR. Ghaffarian
- Development of High Temperature Tantalum Polymer CapacitorsAntony P. ChackoJames ChenChris StolarskiCristina MotaCaetanoPhilip Lessner
- Bumping Process Impact on the Chip Package Interaction (CPI) ReliabilityLei FuMilind BhagavatIvor Barber
- Process Development of Al-alloy Wire Bonding for High-Temperature Power ElectronicsXuan CheTao XuJason FuOmid Niayesh
- 5G Systems and Packaging OpportunitiesRick Sturdivant
- Enabling a Robust Copper Seed Etch Process for Fine Line RDL by Electroplating on a Thin PVD Seed LayerMarvin BerntPaul Van ValkenburgDavid SurdockPrayudi Lianto
- Scalable hybrid microelectronic-microfluidic integration of highly sensitive biosensorsPatrick ReineckeMarie-Theres PutzeLeopold GeorgiRuben KahleDavid KaiserDaniel HügerPavel LivshitsJens WeidenmüllerThomas WeimannAndrey TurchaninTanja BraunKarl-Friedrich BeckerMartin Schneider-RamelowKlaus-Dieter Lang
- Fluxes Effective in Suppressing Non-Wet-Open at BGA AssemblyFengying ZhouFen ChenNing-Cheng Lee
- Novel formaldehyde-free electroless copper for plating on next-generation substratesChristian WendelnEdith SteinhäuserLutz StampBexy Dosse-GomezElisa LanghammerSebastian ReiberSebastian DünnebeilSandra Röseler
- Photosensitive Polyimide having low loss tangent for RF applicationMasao TomikawaHitoshi ArakiYohei KiuchiAkira Shimada
- High reliable and high bonding strength of silver sintered joints on copper surfaces by pressure sintering under air atmosphereLy May ChewWolfgang Schmitt
- High Frequency Base Materials: Laser-Material Interaction for HDI/ICP ApplicationsChristopher RyderGeoffrey LottRuolin ChenNicolas Falletto
- Wire Bonding Advances for Multi-Chip and System in Package DevicesHui XuAashish ShahBasil MiltonIvy Qin
- Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJohn LauMing LiYang LeiMargie LiIris XuTony ChenQing Xiang YongZhong ChengWu KaiPenny LoZhang LiKim Hwee TanY. M. CheungNelson FanEric KuahCao XiJiang RanRozalia BeicaSze Pei LimN. C. LeeC. T. KoHenry YangY. H. ChenMian TaoJeffery LoRicky Lee
- Converter-Level Integration for Wide Band-Gap Automotive Power ElectronicsC Mark JohnsonJordi EspinaBehzad AhmadiJingru DaiBassem MouawadLee EmpringhamLiliana De LilloChristina Dimarino
- Investigation towards the optimum of power capability, ageing stability and costs effectiveness on thick film resistor pastes for AlN ceramicsRichard SchmidtManja MarcinkowskiClaudia FellerUwe Partsch
- Low-fire Processing and Dielectric Properties of a Binary Crystallizable Glasses+alumina SystemShih-An TungJau-Ho Jean
- Characterization of Fine-Pitch Interconnections (≤ 10 μm) on Silicon Interconnect Fabric for Heterogeneous IntegrationSivaChandra JangamAdeel BajwaKannan K. ThankappanSubramanian S. Iyer
- Novel Low Temperature Curable Photosensitive Negative-tone Polyimide with Higher Resolution and ReliabilityDaisaku MatsukawaHiroko YotsuyanagiShiori SakakibaraNoriyuki YamazakiTetsuya EnomotoTakeharu Motobe
- Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and ChallengesAndreas UngerMatthias HunstigTobias MeyerMichael BrökelmannWalter Sextro
- Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable ApplicationsJianbiao PanMalcolm KeifJoshua LedgerwoodXiaoying RongXuan Wang
- Systematic Design of Ka-band Transmitter Modules using the M3-ApproachIvan NdipChristian TschobanJacob ReyesBrian CurranKlaus-Dieter Lang
- Highly Reliable Solderless Contact with Press-fit Technology for Power ModulesMinoru EgusaHidetoshi IshibashiYoshitaka OtsuboMasao KikuchiYoshihiro Kashiba
- Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving ApplicationsMollie BensonBurton CarpenterAndrew Mawer
- Understanding Mold Compound Behavior on Flip Chip QFN PackagesRuby Ann M. CamenforteJason ColteRichard SumalinogSylvester SanchezJaimal Williamson
- Smart and Connected Bioelectronics for Seamless Health Monitoring and Persistent Human-Machine InterfacesYun-Soung KimWoon-Hong Yeo
- THE IMPACT OF GLASS STYLE AND ORIENTATION ON THE RELIABILITY OF SMT COMPONENTSMaxim SerebriniGreg Caswell
- Copper Oxidation Effect in the EMC/Cu Interfacial Adhesion Improvement for a Novel Copper Interconnection Substrate ApplicationMin-Fong ShuYi-Hsiu Tseng
- Fine Pitch Paste for System-in-Package ApplicationsZhang RuifenSarangapani MuraliVinobaji SureshkumarTeo LinglingLoke Chee KeongChan Li-San
- Processing Through Glass Via (TGV) Interposers for Advanced PackagingCharles WoychikJohn LaufferDavid BajkowskiMichael GaigeRobert EdwardsGordon BenningerWilliam Wilson
- Recess in the motherboard architectures for small form factor systemsTim SwettlenJuan LanderosScott MoklerAntonio Caputo
- Chip Package Interaction: Understanding of Contributing Factors in Back End of Line (BEoL) Silicon, Cu Pillar Design and Applied Process ImprovementsFrank KuechenmeisterDirk BreuerHolm GeislerBjoern BoehmeKashi Vishwanath MachaniMichael HeckerSven KosgalwiesJae Kyu ChoDongming HeXuefeng ZhangLily Zhao
- Development of skills and tools for micro opto-electrical integration on wafer levelSaskia SchröderVanessa StenchlyHans-Joachim QuenzerWolfgang Reinert
- RF Test Article Experiment on the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical AssembliesJoshua S. PetkoPhilip A. LovellJeremy D. CliftonAlexander J. BersaniKarl F. Schoch
- System ElectroThermal Co-Design of a Zero-Drift Current-Shunt Monitor with Precision Integrated Shunt ResistorJie ChenRajen MuruganSteven KummerlUsman ChaudhryEdwin LimTatsuhiro ShimizuThatcher KlumppJack Grantham
- Cu diffusion into the glass under bias temperature stress condition for through glass vias (TGV) applicationsHoon KimLing CaiAlbert FaheyRajesh VaddiBin ZhuPrantik Mazumder
- X-ray Advances in Support of Advanced Packaging – Today and TomorrowDavid Bernard
- Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in ApplicationsDave SaumsTim JensenCarol GowansSeth HomerRon Hunadi
- Sn3.2Ag0.7Cu5.5Sb Solder Alloy with High Reliability Performance up to 175CJie GengHongwen ZhangFrancis MutukuNing-Cheng Lee
- Low Dk and Df Photosensitive Insulation Material for Low Transmission Loss PackagesShinichiro AbeKazuyuki MitsukuraYuki ImazuMasaya TobaTakashi MasukoKazuhiko Kurafuchi
- Enhancements to Picosecond Acoustic Metrology for application in FO-WLP ProcessM. MehendaleR. MairJ. ChenJ. TanJ. DaiP. MukundhanC. KimT. Kryman
- Lithographic evaluation of thin photoimageable dielectric dry film for advanced panel level packaging applicationsKeith BestOgnian DimovSudmun HabibSanjay Malik
- Enabling High-Performance Heterogeneous Integration via Interface Standards, IP Reuse, and Modular DesignAndreas OlofssonDaniel S. GreenJeffrey Demmin
- Thin Core Substrate Large Size FCBGA Stress and Thermal Challenges and CharacterizationPoHsien SungIan HuPenny YangAvis FengShouyi ChinMengKai ShihDavid TarngMarwan WangCP Hung
- MOCVD Copper Metallization for High Aspect Ratios TSV 3D Integration.Sabrina FadlounDean StephensPatrice GergaudElisabeth BlanquetThierry MourierChris JonesSteve BurgessAmit Rastogi
- A study of Sub-micron Fan-out Wafer Level Packaging solutionsCanonYoshio GOTOKosuke URUSHIHARABunsuke TAKESHITAKen-Ichiro MORI
- Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-attach MaterialsTomofumi WatanabeKeisuke TanakaMasafumi Takesue
- System-level Trade-offs and Optimization for Data-Driven ApplicationsPushkar ApteTom SalmonRichard RiceMark GerberPatricia MacleodRozalia BeicaJeff CalvertDave HemkerYezdi DordiManish RanjanSuresh RamalingamJaspreet GandhiAlireza KavianiSubhasish MitraPhilip WongVincent LeeMohamed M. Sabry Aly
- 3D Printed and Additively Manufactured RoboSiC™ for Space, Cryogenic, Laser and Nuclear EnvironmentsWilliam A. Goodman
- Smart Passivation Materials with a Microencapsulated Liquid Metal for Self-Healing Conductors in Sustainable Electronic DevicesKunmo ChuByong Gwon SongYongsung KimChang Seung Lee
- Growth of Intermetallics at Coated Silver Wire Bond InterfacesSarangapani MuraliWong Chin Yeung Jason
- Analysis of Ultrasonic Welding of Mechanically Coupled Small Area Contacts for a Silicon Carbide Power ModuleKuldeep SaxenaAryn HaysIvan KaoZach Cole
- fcLGA Package Assembly Qualification for Mobile ApplicationsMumtaz Y. Bora
- Universal Connection Matrix: A Breadboard in a PackageErik WelshGene FrantzMasood Murtuza
- Fatigue Cycling of Electrical Interconnects Dispensed on Flexible SubstrateMohammed AlhendiJack P. LombardiGuvinder S. KhindaMaan Z. KokashDarshana L. WeerawarnePeter BorgesenMark D. PoliksNancy C. StoffelJoe Iannotti
- Result of high accelerated stress test of organic substrates made by integrated dry processTomoyuki HabuShinichi EndoShintaro Yabu
- New Photosensitive Dielectric Material for High-Density RDL with Ultra-Small Photo-Vias and High ReliabilityDaichi OkamotoYoko ShibasakiDaisuke ShibataTadahiko Hanada
- Assessment of Wave-Guided Ultrasonic Transducer System for Erosion-Corrosion Detection in Nuclear ApplicationsAparna AravelliDwayne McDanielClarice Davila
- A Reusable 3D Printed Cavity Resonator for Liquid Sample CharacterizationSaranraj KaruppuswamiSaikat MondalMohd Ifwat Mohd GhazaliPremjeet Chahal
- BATCH MICROWAVE PLASMA CLEANING FOR ROBUSTNESS ENHANCEMENT OF AUTOMOTIVE DEVICES: AN ALTERNATIVE TO STRIP-TYPE RADIOFREQUENCY PLASMAGhizelle Jane E. AbarroRod J. Delos SantosAlvin B. DenoyoDarwin De LazoManny S. Ramos
- Increase Power Density and Simplify Designs Using 3-D SiP ModulesSteven KummerlCharles DevriesUsman ChaudhryChong Han Lim
- Additive Manufacturing for Multi-chip ModulesZhenzhen ShenAleksey Reiderman
- Unlocking the full Potential of Lithography for Advanced PackagingJelle van der VoortMichiel van der Stam
- Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die AttachGuangyu FanChristine LabarberaNing-Cheng LeeColin Clark
- Fabrication of an advanced epoxy based molding compound with high thermal conductivity and outstanding mechanical propertiesNazila DadvandMina DadvandGeorges Kipouros
- Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) ProcessesMichelle FowlerJohn P. MasseyMatthew KochKevin EdwardsTanja BraunSteve VogesRobert GernhardtMarkus Wohrmann
- Electrochemical capacitance based method applied to epoxy molded devicesPaolo RolandiLuca MagagninCarlo ValzasinaDaniele De PascalisAlessandro TocchioAudrey Betty Marie GarnierGiuseppe FiloniFrancesco Pecchia
- Implementation of a Temperature Ramp Rate Requirement and Impact on the Packaging ProcessesRandy HammDaren WhitlockRyan EatingerJeremy StearnsSamuel Ringwood
- Perspectives of High-Temperature Pb-Free Bonding MaterialsHongwen ZhangNing-Cheng Lee
- When Failure is not an Option – Packaging Materials and Technologies for the Reliable Protection of Medical ElectronicsTh. ZettererJ. HerzbergJ. BaehrK. Waxman
- Power cycle tests of high temperature Ag sinter die-attach on metalized ceramic substrate by using micro-heater SiC chipDongjin KimShijo NagaoNaoki WakasugiYasuyuki YamamotoAiji SuetakeTetsu TakemasaKatsuaki Suganuma
- Molding Recipe Study for MUF Solder Crack ImprovementScott ChenLeander LiangPallas HsuTim TsaiMason LiangMichael Shy
- Applicability of Selective Laser Reflow for Thin Die StackingLuke A. WentlentJames WilcoxMohammed Genanu
- Flexible PET Substrate for High Definition Printing of Polymer Thick Film Conductive PastesArt Dobie
- FCCSP IMC Growth under Reliability Stress follow Automotive CriteriaWei-Wei Liu (Xenia)Berdy WengJerry LiCK Yeh
- Novel Low Temperature Curable Photo-Patternable Polyamide with High Planarity for Wafer Level Fan-Out Packaging (WLFO)Daniel NawrockiAndrew CooperTakanori KoizumiShinya InagakiNaoki KawamotoNao HondaKristina MarktMilton Bernal
- Ultra-Wideband High Gain Vivaldi Antennas Using Additive ManufacturingMohd Ifwat Mohd GhazaliPremjeet Chahal
- Evaluation of Low Cost, High Temperature Die and Substrate Attach Materials for Silicon Carbide (SiC) Power ModulesSayan SealBrandon PassmoreBrice McPherson
- Novel Solder Alloy with Wide Service Temperature Capability for Automotive ApplicationsJie GengHongwen ZhangFrancis MutukuNing-Cheng Lee
- Fine line panel level fan out changes the SiP landscapeDavid FangMichael HsuCC ChangKW ChungAlex LiuIrving LinDaniel Fann
- The Effect of Nickel Oxidation Formed in the Interface of ENEPIG Structure for Flip Chip TechnologyChuan Lung ChuangMin-Fong ShuYi-Hsiu Tseng
- Solderable Polymer Thick-film Conductors for Low Temperature SubstratesSeigi SuhRyan PersonsDoug HargroveGregory Berube
- Ribbon CeramicsJohn A. Olenick
- Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit BoardBrian CurranJacob ReyesChristian TschobanIvan NdipKlaus-Dieter LangJens LeißMarta Martinez-VazquezRens Baggen
- Design of Solder Connections for Self-Assembly of Optoelectronic DevicesThomas F. MarinisJoseph W. Soucy
- Reliability of Novel Ceramic Encapsulation Materials for Electronic PackagingS. KaessnerM.G. ScheibelS. BehrendtB. BoettgeK.G. Nickel
- Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment ApplicationFrank Fan WangWilliam McKeagueChristina Polwarth
- High Performance EMI Shielding Materials and Spraying Process Parameters for High Frequency FCBGA ApplicationKisu JooKyu Jae LeeJung Woo HwangJin-Ho YoonYoon-Hyun KimSe Young Jeong
- Reversed Pulse Plating of Silver-Cobalt for Connector ApplicationsNazila DadvandMina DadvandGeorges Kipouros
- Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous IntegrationCheng-Ta KoHenry YangJohn LauMing LiMargie LiCurry LinJW LinChieh-Lin ChangJhih-Yuan PanHsing-Hui WuYH ChenTony ChenIris XuPenny LoNelson FanEric KuahZhang LiKim Hwee TanChia-Hung LinRozalia BeicaMarc LinCao XiSze Pei LimNC LeeMian TaoJeffery LoRicky Lee
- Electrical Characterization of Low Temperature PECVD Oxides for TSV ApplicationsPiotr MackowiakRachid AbdallahMartin WilkeJash PatelHuma AshrafKeith BuchananKlaus-Dieter LangMartin Schneider-RamelowHa-Duong Ngo
- Warpage Behaviors of System-in-Packages on a Substrate StripEric OuyangBilly AhnSeonMo GuJim HsuYonghyuk JeongJaeMyong KimSusan LinGoran LiuAnthony Yang
- Optical Run-Out Correction for Improved Lithography Overlay Accuracy for FOWLP ApplicationsHabib HichriWilliam VisMarkus Arendt
- Investigation of a proactive glass filler removal in IC substrate build up films and its effect on topography and copper adhesion reliabilityStefan KempaWolfgang FrizFlorian GaulEllen HabigLaurence J. Gregoriades
- A 3D System-in-Package for RF ApplicationsShihwen LuChanlin YehGavin KaoYE YehHarrison Chang
- Ultra-Fine Pitch Wedge bonding for Device Reliability CharacterizationLacey L. BadgerNikholas G. ToledoDerek W. SlottkeJohn ThomasMiguel AlamilloElliott GunnarssonMark L. Le RuttIlan Tsameret
- Aqueous Washable Thermal Resistant Coatings and AdhesivesJohn Moore
- Glass Packaging for RF MEMSRajiv ParmarJay ZhangChris Keimel
- Study on high temperature resistant die bonding formed by Al/Ni nano-particles composite pasteYasunori TanakaTatsumasa WakataNorihiro MurakawaTomonori IizukaKohei Tatsumi
- Zinc Oxide Nanowire Sensor PackagingBruce KimSang-Bock Cho
- “A Cross-Domain, System Planning Methodology”Bill ACITO
- Fine Pitch(40μm) Integration Platform for Flexible Hybrid Electronics using Fan-Out Wafer-level PackagingAmir HannaArsalan AlamG. EzhilarasuSubramanian S. Iyer
- Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applicationsSiddharth RavichandranShuhei YamadaTomonori OgawaTailong ShiFuhan LiuVanessa SmetVenky SundaramRao Tummala
- Mixed-Port Hybrid Parameters for High-Speed Differential LinesA. Ege EnginIvan NdipKlaus-Dieter LangJerry Aguirre
- A Systematic Approach to the Reliability Characterization of System in Package (SiP)Karthikeyan DhandapaniBrian RoggemanDavid Rae
- High Performance Etchable RoHS Compliant Thick Film Gold ConductorSamson ShahbaziGregg BerubeStephanie EdwardsRyan PersonsCaitlin Shahbazi
- Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing costHenning HübnerChristian OhdeDirk Ruess
- Productivity Comparison of Wafer Transport Architectures in PVD Tools Used for Fan-Out Packaging RDL Barrier/Seed FormationTerry BluckChris SmithPaul Werbaneth
- Packaging and Integration Strategy for mm-Wave ProductsUrmi RayNJ ChoYC KimSW YoonWK ChoiPandi Marimuthu
- Advanced Build-up Materials for High Speed Transmission ApplicationShiro TatsumiShohei FujishimaHiroyuki Sakauchi
- Advanced Packaging for Automotive Dashboard ApplicationNokibul IslamHC Choi
ACITO, Bill. 2018. “‘A Cross-Domain, System Planning Methodology.’” IMAPSource Proceedings 2018 (1): 5–12. https://doi.org/10.4071/2380-4505-2018.1.000005.