Advanced Package Design: Inter-Domain Design Methodologies

Bill Acito; Engineer IC Packaging Product

doi:10.4071/2380-4505-2019.1.000284

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Acito, Bill, and Engineer IC Packaging Product. 2019. “Advanced Package Design: Inter-Domain Design Methodologies.” IMAPSource Proceedings 2019 (1): 284–88. https://doi.org/10.4071/2380-4505-2019.1.000284.

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