ISSN 2380-4505
Articles in Vol. 2020, Issue DPC, 2020
Vol. 2020, Issue DPC, 2020
- Trends in FOWLP: 600mm Panel Level for 6-Sided Die Protection with M-SeriesJacinta Aman Lim
- Through Silicon Via Undercut Profile Optimisation for 3D Packaging ApplicationsPaul Gray
- This is Not Your Fathers Advanced Semiconductor Packaging…An EDA PerspectiveJohn Park
- Thin Quad Die Package (QDP) DevelopmentShaun Bowers
- Thermal Management Implications for Heterogeneous Integrated PackagingCameron Nelson
- Samsung Foundry’s 3D Package Solution based on Cadence Design FlowMax MinSungwook Moon
- Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level PackagingYuji Okada
- Polymer Enabled Ultra-Thin Package Solutions for Heterogeneous, Package-in-Package and Embedded ICsDoug Hackler
- Permanent Bonding Adhesive: A Novel Permanent Bonding MaterialTrevor StanleyReihaneh SejoubsariXiao Liu
- Paths Towards Ultra High-Density Interconnect 3D Systems: Contribution of Wafer Geometry for Achieving Sub 200NM Wafer-to-Wafer Bonding OverlaySerena IacovoJoeri DevosAlain PhommahaxayAndy MillerEric BeyneThomas UhrmannAndreas Fehkuhrer
- PCB Embedding of Magnetic Material for Inductor-Based ApplicationsGerald Weis
- PCB Embedding Technology for 5G mmWave ApplicationsStefan KosmiderUwe MaassKavin Senthil MurugesanLars Böttcher
- Multipurpose Use of Laser-Sensitive Materials for Temporary Bonding and Debonding Applications in Wafer-Level PackagingLuke Prenger
- Interconnect Transitions and the Challenges AheadE. Jan Vardaman
- Integration Technologies Transforming the WorldYin ChangRich Rice
- Integrated Packaging Technologies for High-Performance Computing Systems: Challenges and OpportunitiesMax Min
- Improved Optical Profiler Metrology for Advanced PackagingSamuel LeskoRobert Cid
- High Density Integrated Stack Capacitor (ISC) for Advanced Package SolutionsMax MinKevin J. JangSugmin HongJaeYup ChungYoojeong JeongSunwoo ParkJihyung KimJuyong Lee
- Heterogeneous System-in-Package (HSIP) Using Fan-Out Wafer-Level Packaging (FOWLP)Charles WoychikJustin BorskiRobert Nead
- Heterogeneous Integration, Dielets and Chiplets – Why the Hype?Subramanian S. Iyer
- Glass Panel Embedding (GPE) for High-Frequency ApplicationsSiddharth RavichandranAtom WatanabeNobuo OguraMadhavan SwaminathanRao Tummala
- Get MOoRE Out of the PackageWolfgang Sauter
- Fan Out Wafer Level Package With Enhanced Product Reliability and Advanced Node Silicon Chip Package IntegrationGaurav SharmaNishant LakheraCraig BeddingfieldMollie BensonAdnrew J. Mawer
- Embedded Trace and RDL Copper Plating Process for Panel Level Packaging ApplicationsKesheng FengLeslie KimJohnny LeeSaminda DharmarathnaWilliam BowermanJim Watkowski
- Development of Additive Technology for Advanced PackagingJason RouseTakanori InoueTaichi HamadaYusuke FujitaYoshifumi SugisawaMitsuru TanikawaTakashi Watanabe
- Design Rule Study of Compression Molding Process on Polymer Cavity PackagesNao HondaYoshihiro Hakone
- Copper Wire Ready for Automotive AEC Requirements?William Crockett
- Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous IntegrationThomas UhrmannJürgen BurggrafMariana Pires
- Automotive Packaging Trends - Challenges and SolutionsEungSan ChoThorsten Meyer
- Autocatalytic Tin: How to Overcome Process Limitations to Introduce a New Solution for Thick Tin PlatingBritta Schafsteller
- An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based ElectronicsDon HunterGary BolotinMalcolm LiasBen Cheng
- Advanced Packaging Leading Electronics Industry Transition into Next DecadeVaibhav Trivedi
- Adaptive High Density RDL Technologies for Panel Level PackagingLars Böttcher
- Achieving Success in Automotive Leadframe PackagesJohn Nickelsen
- Thin Glass Substrates with Through-Glass ViasAric ShoreyShelby NelsonDavid LevyPaul Ballentine
- The New Technology Solutions for Advanced SiP DevicesYongJai Seo
- Solution for Accelerator Wall of HPC with HBM Integrated PackagesJinWei You
- Prototyping IoT Modules and Assembling by Additive ManufacturingYoko FujitaSteven Watt
- Micro-features in Glass using Laser Induced Deep Etching for Device PackagingJean-Pol DelrueRafael SantosNorbert AmbrosiusRoman OstholtStephan Schmidt
- Memory Chip-to-Chip Integration for High Bandwidth Memory Processor InterfaceAndy HeinigFabian Hopsch
- Leading Edge Glass Interposer for High Frequency ApplicationSatoru KuramochiMasaya Tanaka
- In-process Warpage Prediction and Optimization for Heterogeneously Integrated Packages Using a Novel Thermo-mechanical Modeling SchemePriyal ShahMilind Bhagavat
- Improving WID & WIW Non-Uniformity in ECD ApplicationsCharles SharbonoI -Wen Hsieh
- Glass Interposers Using Cu-plated Through Glass Vias (TGVs)Charles WoychikJustin BorskiRobert Nead
- Fluxless Bonding Via In-Situ Oxide ReductionBob Chylak
- Enhancing the Punch MLF®/QFN Package for Improved Robustness in Automotive ApplicationsMarc A. Mangrum
- Enabling Fine Line RDL and High Aspect Ratios for CU Pillars for Heterogeneous IntegrationFabian BenthausHabib HichriMarkus ArendtMatthew Gingerella
- Die Crack Prevention and Detection in Advanced PackagingWoo Young Han
- Die Backside Metallization for Low Cost High Thermal PackageNokibul Islam
- Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D IntegrationThomas WorkmanGuilian GaoGabe GuevaraCyprian UzohGill FountainJeremy TheilDominik SuwitoLaura Mirkarimi
- Coating Adhesion TestingTom Monaghan
- Applications of Novel High-Speed In-line Automatic X-ray Inspection in High-Volume ManufacturingFrank Chen
- An Instrumented Getter for Hermetically Sealed PackagesRobert N. DeanMichael Previti
- Advanced Double Side SiPwith Thermal Enhance Solutions for 5G Mobile ApplicationWen-Jung (Mike) Tsai
- A New Level of Connectivity- 5G Package ConsiderationsMark GerberHarrison ChangWayne LuGavin KaoJonathan ChoRoger Hwang
- 10 micron Pitch Wiring and Bump on Substrate Formed by Imprinting Technology to Apply Low Temperature Flip Chip BondingHiroshi KomatsuNozomi ShimoishizakaToshihiro Yamada
Monaghan, Tom. 2024. “Coating Adhesion Testing.” IMAPSource Proceedings 2020 (DPC): 936–58. https://doi.org/10.4071/001c.117019.