Vol. 2020, Issue DPC, 2020April 18, 2024 EDT
An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics
An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics
Hunter, Don, Gary Bolotin, Malcolm Lias, and Ben Cheng. 2024. “An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics.” IMAPSource Proceedings 2020 (DPC): 177–91. https://doi.org/10.4071/001c.116701.