Vol. 2020, Issue DPC, 2020April 16, 2024 EDT
Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging
Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging
Okada, Yuji. 2024. “Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging.” IMAPSource Proceedings 2020 (DPC): 69–98. https://doi.org/10.4071/001c.116639.