This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:39619/feed
ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020April 24, 2024 EDT

Enabling Fine Line RDL and High Aspect Ratios for CU Pillars for Heterogeneous Integration

Fabian Benthaus, Habib Hichri, Markus Arendt, Matthew Gingerella,
Heterogeneous Integration3D IntegrationFOWLP
https://doi.org/10.4071/001c.116981
IMAPSource Conference Papers
Benthaus, Fabian, Habib Hichri, Markus Arendt, and Matthew Gingerella. 2024. “Enabling Fine Line RDL and High Aspect Ratios for CU Pillars for Heterogeneous Integration.” IMAPSource Proceedings 2020 (DPC): 306–40. https:/​/​doi.org/​10.4071/​001c.116981.

View more stats

Powered by Scholastica, the modern academic journal management system