ISSN 2380-4505
Vol. 2020, Issue DPC, 2020April 24, 2024 EDT
Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration
Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration
Workman, Thomas, Guilian Gao, Gabe Guevara, Cyprian Uzoh, Gill Fountain, Jeremy Theil, Dominik Suwito, and Laura Mirkarimi. 2024. “Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration.” IMAPSource Proceedings 2020 (DPC): 722–41. https://doi.org/10.4071/001c.116998.