Vol. 2020, Issue DPC, 2020April 24, 2024 EDT
In-process Warpage Prediction and Optimization for Heterogeneously Integrated Packages Using a Novel Thermo-mechanical Modeling Scheme
In-process Warpage Prediction and Optimization for Heterogeneously Integrated Packages Using a Novel Thermo-mechanical Modeling Scheme
Shah, Priyal, and Milind Bhagavat. 2024. “In-Process Warpage Prediction and Optimization for Heterogeneously Integrated Packages Using a Novel Thermo-Mechanical Modeling Scheme.” IMAPSource Proceedings 2020 (DPC): 632–41. https://doi.org/10.4071/001c.116996.