Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:8873/feed
ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2020, Issue DPC, 2020April 18, 2024 EDT

PCB Embedding Technology for 5G mmWave Applications

Stefan Kosmider, Uwe Maass, Kavin Senthil Murugesan, Lars Böttcher,
Embedded Die technologyLow Loss Materials5G
https://doi.org/10.4071/001c.116709
IMAPSource Conference Papers
Kosmider, Stefan, Uwe Maass, Kavin Senthil Murugesan, and Lars Böttcher. 2024. “PCB Embedding Technology for 5G mmWave Applications.” IMAPSource Proceedings 2020 (DPC): 282–305. https:/​/​doi.org/​10.4071/​001c.116709.

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

cookies
cookies
cookies
Powered by Scholastica, the modern academic journal management system