ISSN 2380-4505
Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Rugged ICs against Corrosion, Shock plus Hotter Temperatures
Rugged ICs against Corrosion, Shock plus Hotter Temperatures
James J. Wang,
Articles in Vol. 2010, Issue HITEC, 2010
Vol. 2010, Issue HITEC, 2010
- Piezoelectric Structural Sensor Technology for Extreme EnvironmentsMichael Ian LapsleyEdward F. AlbertaRaffi SahulWesley HackenbergerXiaoning JiangShujun ZhangThomas Shrout
- Rugged ICs against Corrosion, Shock plus Hotter TemperaturesJames J. Wang
- The Behaviour of Au-Au Wire Bonds in Extreme EnvironmentsD. ShepherdP.S. GrantC. JohnstonS. Riches
- Packaging Technology for High Temperature Capacitive Pressure SensorsLiang-Yu ChenGlenn M. BeheimRoger D. Meredith
- New High Temperature Electronic Components for Power Management and Motor Control ApplicationsPierre DelatteV. DessardA. SaibN. PequignotG. PicúnL. DemeûsL. MartinezT. KrebsJ.-C. Doucet
- Modeling and Simulation of the Thermal Drift Characteristics of the Piezoresistive Pressure SensorR. OtmaniN. BenmoussaK. Ghaffour
- High Temperature Lithium Alloy Cells With Improved Low Temperature PerformanceArden P. JohnsonCuiyang WangJohn S. Miller
- Assessing the Reliability of Die Attach Materials in Electronic Packages for High Temperature ApplicationsM.F. SousaS. RichesC. JohnstonP.S. Grant
- High-Temperature, Bulk-CMOS Integrated Circuits for a Distributed FADEC SystemSteve MajerusDaniel HoweSteven GarverickDavid HiscockWalter Merrill
- SiC Power Switch ModuleMichael J. PalmerR. Wayne JohnsonTracy AutryRizal AguirreVictor LeeJames D. Scofield
- High Temperature (230 °C) Isolated Power SupplyB. ReeseR. ShawJ. HornbergerR. SchupbachA. Lostetter
- Edge-Controlled Mechanical Failure of Si and SiC Semiconductor ChipsA. A. WereszczakO. M. JadaanT. P. Kirkland
- 285°C Resistor Drift and Failure AnalysisMark HahnRon SmithMilton Watts
- Demonstrated Performance Characteristics For Improved High Temperature Ceramic Capacitors Intended For Use In Extreme, Harsh EnvironmentsMustafa A. SyammachMichael J. RoachFauzi A. SyammachMustapha Habibi
- Performance and Reliability Characteristics of 1200 V, 100 A, 200°C Half-Bridge SiC MOSFET-JBS Diode Power ModulesJames D. ScofieldJ. Neil MerrettJames RichmondAnant AgarwalScott Leslie
- High Temperature Inverter for Airborne ApplicationFabien DuboisDominique BergogneDamien RisalettoRémi RobutelHervé MorelRégis MeuretSonia Dhokkar
- High Temperature Capacitors Based on [0001] and [1120] Sapphire DielectricsLiang-Yu Chen
- New Rechargeable Battery for Application in a Wide Temperature RangeJosip CajaT. Don DunstanMario Caja
- High Temperature Performance of Normally-off SiC JFET's Compared to Competing ApproachesJ.B. CasadyD.C. SheridanA. RitenourV. BondarenkoR. Kelley
- High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive BoardsB. ReeseB. McPhersonR. ShawJ. HornbergerR. SchupbachA. LostetterB. RowdenA. MantoothS. AngJ. BaldaK. OkumuraT. Otsuka
- High temperature solders containing Aluminum and ZincH.R. KotadiaO. MokhtariM. BottrillM. P. ClodeM. A. GreenS. H. Mannan
- Capacitor Characterization Study for a High Power, High Frequency Converter ApplicationWilliam C. LanterHiroyuki KosaiTyler BixelB. Allen TolsonJeffery StrickerJames ScofieldNavjot BrarBiswajit Ray
- 1200 V 6 A High Temperature SiC BJTsAnders LindgrenMartin Domeij
- High-Temperature, High-Dielectric-Constant Capacitors for Power Inverters in Hybrid Electric VehiclesU. BalachandranM. NarayananB. Ma
- Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics ApplicationsRakesh Kumar
- HIGH TEMPERATURE ULTRA HIGH VOLTAGE SIC THYRISTORSR. SinghS. CreamerE. LieserS. JeliazkovS. Sundaresan
- Comparison of High Temperature Operation of Silicon Carbide MOSFETs and Bipolar Junction TransistorsJim RichmondSei-Hyung RyuQingchun (Jon) ZhangBrett HullMrinal DasAlbert BurkAnant AgarwalJohn Palmour
- Nanocomposite Film Dielectrics for High Temperature Power Conditioning CapacitorsKirk SlenesLew Bragg
- Thermomechanical Stresses in Copper Films at Elevated TemperatureMartin LedererJavad ZarbakhshRui HuangThomas DetzelBrigitte Weiss
- Swelling Phenomena in Sintered Silver Die Attach Structures at High Temperatures: Reliability Problems and Solutions for an Operation above 350°CN. HeuckS. MüllerG. PalmA. BakinA. Waag
- Robust Class-I BME Ceramic Capacitors for High Temperature ApplicationsAbhijit GuravXilin XuJim MageeJeff FranklinTravis Ashburn
- Compact modeling of the high temperature effect on the single event transient current generated by heavy ions in SOI 6T-SRAME. BoufoussJ. AlvaradoD. Flandre
- A Universal BCD-on-SOI Based High Temperature Short Circuit Protection for SiC Power SwitchesLiang ZuoS. K. IslamM. A. HuqueC. SuB. J. BlalockL. M. Tolbert
- Characterization of Thick Film Technology for 300°C PackagingRui ZhangR. Wayne JohnsonVinayak TilakTan ZhangDavid Shaddock
- Effect of High Temperature Ageing on Active and Passive Power DevicesCyril ButtayRemi RobutelChristian MartinChristophe RaynaudSimeon DampieniDominique BergogneThibaut Chailloux
- Development of a SiC SSPC Module with Advanced High Temperature PackagingDouglas C HopkinsYuan-Bo GuoHerbert E DwyerJames D. Scofield
- Development of a 300°C capable SiC based operational amplifierVinayak TilakCheng-Po ChenPeter LoseeEmad AndarawisZachary Stum
- Application of High Temperature Electronics Packaging Technology to Signal Conditioning and Processing CircuitsS T RichesK CannonC JohnstonM SousaP GrantJ GulliverM LangleyR PittsonS SerbanD BaghurstM Firmstone
- A High-Temperature Folded-Cascode Operational Transconductance Amplifier in 0.8-μm BCD-on-SOIC. SuB. J. BlalockS. K. IslamL. ZuoL. M. Tolbert
- SiGe Amplifier and Buffer Circuits for High Temperature ApplicationsDylan B. ThomasNelson E. LourencoJohn D. CresslerSteven Finn
- Practical Oil Field Requirements for New High-Temperature BatteriesRandy Normann
- High Temperature CMOS Reliability and DriftShane Rose
- The Development and Qualification of a DC-DC Converter for 225°C (437°F) Operating TemperatureBob Hunt
- Design of High Temperature EMI Input Filter for a 2 kW HVDC-fed InverterRemi RobutelChristian MartinHerve MorelCyril ButtayDominique BergogneNicolas Gazel
- High Temperature SiC Power Module Electrical Evaluation ProcedurePuqi NingFred WangKhai D. T. Ngo
- Performance and Reliability of MEMS Gyroscopes and Packaging at High TemperaturesPatrick McCluskeyChandradip PatelDavid Lemus
- A Comparison of Multilayer Ceramic Capacitor Technologies for High Temperature ApplicationsCraig NiesScott HarrisStanley Cygan
- Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power ApplicationsSatoshi TanimotoKohei MatsuiYoshinori MurakamiHiroshi YamaguchiHajime Okumura
- Reliability Assessment of Passives for 300C using HALTDavid ShaddockVinayak TilakTan ZhangRui ZhangR. Wayne Johnson
- Modeling and Design of High Temperature Silicon Carbide DMOSFET Based Medium Power DC-DC ConverterSiddharth PotbhareAkin AkturkNeil GoldsmanJames M. McGarrityAnant Agarwal
- Metallurgy for SiC Die Attach for Operation at 500°CPing ZhengPhillip HensonR. Wayne JohnsonLiangyu Chen
- Performance of commercial SOI driver in harsh conditions (up to 200°C)K. El FalahiB. AllardD. TournierD. Bergogne
- “Migration of Sintered Nanosilver Die-attach Material on Alumina Substrate at High Temperatures”Yunhui MeiDimeji IbitayoXu ChenSusan LuoGuo-Quan Lu
Wang, James J. 2010. “Rugged ICs against Corrosion, Shock plus Hotter Temperatures.” IMAPSource Proceedings 2010 (HITEC): 343–48. https://doi.org/10.4071/HITEC-JWang-THA14.