ISSN 2380-4505
Vol. 2010, Issue HITEC, 2010January 01, 2010 EDT
Characterization of Thick Film Technology for 300°C Packaging
Characterization of Thick Film Technology for 300°C Packaging
Rui Zhang, R. Wayne Johnson, Vinayak Tilak, Tan Zhang, David Shaddock,
Zhang, Rui, R. Wayne Johnson, Vinayak Tilak, Tan Zhang, and David Shaddock. 2010. “Characterization of Thick Film Technology for 300°C Packaging.” IMAPSource Proceedings 2010 (HITEC): 97–107. https://doi.org/10.4071/HITEC-RWJohnson-TP12.