ISSN 2380-4505
Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid Integration
Articles in Vol. 2020, Issue 1, 2020
Vol. 2020, Issue 1, 2020
- Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical PropertiesJong-Gi LeeJin-Soo BaeYeo-Hoon YoonJun-Ho LeeKang-Young Cho
- Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire BondingAndreas UngerMatthias HunstigMichael BrökelmannDirk SiepeHans J. Hesse
- Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packagingFelix HäußlerShengxia ShenSimon PetillonSascha WeserMehmet HaybatWolfgang EberhardtAndré ZimmermannJörg Franke
- Wire Bonding: The Ultrasonic Bonding MechanismLee Levine
- Detecting a security breach and pinpointing its sourceDave Huntley
- Hybrid Bonding of Via-middle TSV Wafer Fabricated using Direct Si/Cu Grinding, Residual Metal Removal, CVD, and CMPNaoya WatanabeHiroshi YamamotoTakahiko MitsuiEiichi Yamamoto
- Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power ModuleTzu-Hsuan ChengKenji NishiguchiYoshi FukawaB. Jayant BaligaSubhashish BhattacharyaDouglas C. Hopkins
- Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit BoardsDaphne PappasSebastian GuistDhia Ben Salem
- Ultra-low Residue Flux Applications in RF Front-End PackagesLeo HuSze Pei Lim
- Acceleration Factors and Life PredictionsP.E. Chris South
- Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal CyclingDae-Suk KimKarthikeyan Dhandapani
- The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu filmsTobias BernhardSebastian ZarwellEdith SteinhäuserStefan KempaFrank Brüning
- Versatile TIM Solution with Chain Network Solder CompositeRunsheng MaoSihai ChenElaina ZitoDavid BednerNing-Cheng Lee
- Packaging Issues and Solutions for Ultra-Low Power, High Efficiency GaN micro-LEDs for a Battery Free, Sub-mm2, Tetherless, Smart IoT SystemF.R. LibschS.W. BedellB.C. WebbA. Paidimarri
- Enhancement of ESD performances of Silicon Capacitors for RFID solutionsSébastien JacquelineCatherine BunelLaurent Lengignon
- Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic GraphiteRiya PaulAmol DeshpandeFang LuoWei Fan
- Thermal improvement in 3D embedded modules using copper bar viasManoj KakadeRichard DowlingMumtaz BoraJake TubbsAhmed Maghawri
- Control of Void Formation in Adhesively Bonded Joints in the Presence of FillerNina S. DytiukThomas F. MarinisJoseph W. Soucy
- Electrical Performance and Robustness of Ultrathin High-Density Carbon Nanofiber Capacitors on Silicon, Alumina and Glass Substrate MaterialsR. AnderssonM. BylundV. DesmarisS. KabirS. KrauseV. MarknäsE. PassalacquaA.M. Saleem
- Electromigration in Power DevicesHao ZhuangRobert BauerMarkus Dinkel
- Gate Driver Design in a 1 μm SiC CMOS Process for Heterogeneous Integration Inside SiC Power ModuleAffan AbbasiAsif FaruqueSajib RoyRobert MurphreeTobias ErlbacherAlan Mantooth
- An Oxide Wear Model of Ultrasonic BondingBrandon van GoghTioga BennerHenri SeppaenenCalvin TszengPanthea Sepehrband
- Construction Kit of RF-Blocks in Package TechnologiesFabian HopschRobert TriebAndy Heinig
- Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height UniformityRaihei IkumotoYuki ItakuraShinji TachibanaHisamitsu Yamamoto
- Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technologyEiji NakamuraToyohiro AokiRyota YamaguchiNobuhiro SekineKuniaki SueokaChinami MarushimaKenichi YatsugiMakoto YadaTakashi Hisada
- Wire-Bonding Reliability EvaluationSchlumberger Hossein Akbari
- Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission PropertyMasaya TobaKazuyuki MitsukuraMasaki Yamaguchi
- High Heat Resistant Peelable Temporary Bonding Film and New Debonding System with Xe Flash Light IrradiationYuta AkasuEmi MiyazawaTetsuya EnomotoYasuyuki OyamaShogo SobueRyoji FurutaniYuki NakamuraTakashi Kawamori
- Parameter Optimization for Unstable Pin BondingHenri Seppänen
- Selective laser sintering of glass-ceramic bonds using a defocused Nd:YAG laserK. MurawskiK. AristovichH.T. Lancashire
- Advanced No-Clean Solder Paste for SIP applicationsSantosh Kumar RathYam Lip HueiSylvia SutinoChieng Yu YuanSenthil Kumar BalasubramanianYee Ting LoJoel AgalaHanWen ZhangLi-San ChanSungsig KangStefan MausnerSebastian Fritzsche
- Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capabilityRisa MiyazawaEiji NakamuraChinami MarushimaToyohiro AokiTakashi Hisada
- A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D AssemblyGiovanni CapuzMelina LofranoCarine GeretsFabrice DuvalPieter BexJaber DerakhshandehKris VanstreelsAlain PhommahaxayEric BeyneAndy Miller
- Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch DesignMin ChuJie ChenAbidur RahmanRajen Murugan
- Uptake Rate of Hydrogen Getter for Effectively Removing Outgassed H2 from Microelectronic PackagesHua XiaJeffrey VriensDavid DeWire
- Latest Technologies of Epoxy Molding Compound (EMC) for FO-WLPMasahiro IwaiKen UkawaGo IchizawaTakeshi Mori
- Thin Glass Handling Solutions for Microelectronics PackagingAric ShoreyShelby NelsonDavid LevyPaul Ballentine
- Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond PackageFred Fuliang LeRinse van der MeulenYoon Kheong LeongManoj BalakrishnanZunyu Guan
- A novel approach to mitigate stress induced defects at metal-dielectric interface in Redistribution layers for 3D IC stackingAmit KumarJose ChaconPeter GelzinisJulio MorrisAnkineedu Velaga
- Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational TemperaturesTatsushi HayashiPo Yu LinRyoichi WatanabeSeiko Ichikawa
- Wireless Sensor Platform for Nanosensor Interface ElectronicsBruce KimAnurag GuptaMitchell Spryn
- Two-Layer Solder Resist Film with Low Young’s Modulus for High ReliabilityYingHsuan ChouDaichi OkamotoHidekazu Miyabe
- Methods to Reduce the Hierarchy of Interconnections in Electronic SystemDyi-Chung HuJames Ho
- Advanced Die-Beam Alignment Method for Laser-Assisted BondingWagno Alves BragancaKim KyungOe
- Advanced Low Df Dry film Build-up Material on Glass panel for 5G applicationTakenori KakutaniZhong GuanYuya SuzukiMuhammad AliSerhat ErdoganAtom WatanabeMohanalingam KathaperumalMadhavan Swaminathan
- Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid IntegrationDouglas HacklerEdward Prack
- Optimizing X-Ray Inspection for Advanced Packaging ApplicationsBrennan PetersonMichael KwanFred DuewerAndrew ReidRhiannon Brooks
- Lithium Battery Cell Level Fusing with Aluminum Heavy Wire BondsUtkarsh MehrotraArthur BrazzleMichael McKeownDouglas C. Hopkins
- Heterogeneous System-In-Package (HSIP) TechnologyCharles WoychikRobert MundellaKeith KunardVictor VilarJustin BorskiRobert Nead
- Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous IntegrationJohn H LauCheng-Ta KoChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinJJ ChenPo-Chun HuangTzvy-Jang TsengEagle LinLeo ChangCurry LinWinnie Lu
- Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced WafersJohn H LauCheng-Ta KoTzvy-Jang TsengChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinEagle LinLeo ChangHsing Ning LiuCurry LinDavid ChengWinnie Lu
- Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level PackagingYuji OkadaAtsushi FujiiKenta OnoYoshiharu Kariya
- Optical Data Link Module for Data Transmission in Smart CathetersJian LiVincent HennekenMarcus LouwerseRonald Dekker
Hackler, Douglas, and Edward Prack. 2020. “Ultra-Thin Flip-Chip Assembly for Heterogenous and Hybrid Integration.” IMAPSource Proceedings 2020 (1): 146–49. https://doi.org/10.4071/2380-4505-2020.1.000146.