Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity
Ikumoto, Raihei, Yuki Itakura, Shinji Tachibana, and Hisamitsu Yamamoto. 2020. “Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height Uniformity.” IMAPSource Proceedings 2020 (1): 150–55. https://doi.org/10.4071/2380-4505-2020.1.000150.