ISSN 2380-4505
Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Methods to Reduce the Hierarchy of Interconnections in Electronic System
Methods to Reduce the Hierarchy of Interconnections in Electronic System
Articles in Vol. 2020, Issue 1, 2020
Vol. 2020, Issue 1, 2020
- Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical PropertiesJong-Gi LeeJin-Soo BaeYeo-Hoon YoonJun-Ho LeeKang-Young Cho
- Cell Interconnections in Battery Packs Using Laser-assisted Ultrasonic Wire BondingAndreas UngerMatthias HunstigMichael BrökelmannDirk SiepeHans J. Hesse
- Evaluating thermoset resin substrates for 3D mechatronic integrated devices and packagingFelix HäußlerShengxia ShenSimon PetillonSascha WeserMehmet HaybatWolfgang EberhardtAndré ZimmermannJörg Franke
- Wire Bonding: The Ultrasonic Bonding MechanismLee Levine
- Detecting a security breach and pinpointing its sourceDave Huntley
- Hybrid Bonding of Via-middle TSV Wafer Fabricated using Direct Si/Cu Grinding, Residual Metal Removal, CVD, and CMPNaoya WatanabeHiroshi YamamotoTakahiko MitsuiEiichi Yamamoto
- Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power ModuleTzu-Hsuan ChengKenji NishiguchiYoshi FukawaB. Jayant BaligaSubhashish BhattacharyaDouglas C. Hopkins
- Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit BoardsDaphne PappasSebastian GuistDhia Ben Salem
- Ultra-low Residue Flux Applications in RF Front-End PackagesLeo HuSze Pei Lim
- Acceleration Factors and Life PredictionsP.E. Chris South
- Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal CyclingDae-Suk KimKarthikeyan Dhandapani
- The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu filmsTobias BernhardSebastian ZarwellEdith SteinhäuserStefan KempaFrank Brüning
- Versatile TIM Solution with Chain Network Solder CompositeRunsheng MaoSihai ChenElaina ZitoDavid BednerNing-Cheng Lee
- Packaging Issues and Solutions for Ultra-Low Power, High Efficiency GaN micro-LEDs for a Battery Free, Sub-mm2, Tetherless, Smart IoT SystemF.R. LibschS.W. BedellB.C. WebbA. Paidimarri
- Enhancement of ESD performances of Silicon Capacitors for RFID solutionsSébastien JacquelineCatherine BunelLaurent Lengignon
- Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic GraphiteRiya PaulAmol DeshpandeFang LuoWei Fan
- Thermal improvement in 3D embedded modules using copper bar viasManoj KakadeRichard DowlingMumtaz BoraJake TubbsAhmed Maghawri
- Control of Void Formation in Adhesively Bonded Joints in the Presence of FillerNina S. DytiukThomas F. MarinisJoseph W. Soucy
- Electrical Performance and Robustness of Ultrathin High-Density Carbon Nanofiber Capacitors on Silicon, Alumina and Glass Substrate MaterialsR. AnderssonM. BylundV. DesmarisS. KabirS. KrauseV. MarknäsE. PassalacquaA.M. Saleem
- Electromigration in Power DevicesHao ZhuangRobert BauerMarkus Dinkel
- Gate Driver Design in a 1 μm SiC CMOS Process for Heterogeneous Integration Inside SiC Power ModuleAffan AbbasiAsif FaruqueSajib RoyRobert MurphreeTobias ErlbacherAlan Mantooth
- An Oxide Wear Model of Ultrasonic BondingBrandon van GoghTioga BennerHenri SeppaenenCalvin TszengPanthea Sepehrband
- Construction Kit of RF-Blocks in Package TechnologiesFabian HopschRobert TriebAndy Heinig
- Optimization of High-Speed Electrolytic Plating of Copper Pillar to Achieve a Flat Top Morphology and Height UniformityRaihei IkumotoYuki ItakuraShinji TachibanaHisamitsu Yamamoto
- Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technologyEiji NakamuraToyohiro AokiRyota YamaguchiNobuhiro SekineKuniaki SueokaChinami MarushimaKenichi YatsugiMakoto YadaTakashi Hisada
- Wire-Bonding Reliability EvaluationSchlumberger Hossein Akbari
- Electroless Plating with UV Modification for Thermosetting Dielectric and Decay Suppression of High Frequency Transmission PropertyMasaya TobaKazuyuki MitsukuraMasaki Yamaguchi
- High Heat Resistant Peelable Temporary Bonding Film and New Debonding System with Xe Flash Light IrradiationYuta AkasuEmi MiyazawaTetsuya EnomotoYasuyuki OyamaShogo SobueRyoji FurutaniYuki NakamuraTakashi Kawamori
- Parameter Optimization for Unstable Pin BondingHenri Seppänen
- Selective laser sintering of glass-ceramic bonds using a defocused Nd:YAG laserK. MurawskiK. AristovichH.T. Lancashire
- Advanced No-Clean Solder Paste for SIP applicationsSantosh Kumar RathYam Lip HueiSylvia SutinoChieng Yu YuanSenthil Kumar BalasubramanianYee Ting LoJoel AgalaHanWen ZhangLi-San ChanSungsig KangStefan MausnerSebastian Fritzsche
- Simulation and Experimental study on IMS (Injection Molded Solder) bumping with expanded resist patterning for reinforcement of fine-pitch capabilityRisa MiyazawaEiji NakamuraChinami MarushimaToyohiro AokiTakashi Hisada
- A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D AssemblyGiovanni CapuzMelina LofranoCarine GeretsFabrice DuvalPieter BexJaber DerakhshandehKris VanstreelsAlain PhommahaxayEric BeyneAndy Miller
- Methodology to Quantify Impact of Package Delamination on Performance of High-Side Smart Power Switch DesignMin ChuJie ChenAbidur RahmanRajen Murugan
- Uptake Rate of Hydrogen Getter for Effectively Removing Outgassed H2 from Microelectronic PackagesHua XiaJeffrey VriensDavid DeWire
- Latest Technologies of Epoxy Molding Compound (EMC) for FO-WLPMasahiro IwaiKen UkawaGo IchizawaTakeshi Mori
- Thin Glass Handling Solutions for Microelectronics PackagingAric ShoreyShelby NelsonDavid LevyPaul Ballentine
- Evaluation of Emerging High Melting Point Lead-free Solder and Hybrid Sinter Paste as Attaching Material for Clip Bond PackageFred Fuliang LeRinse van der MeulenYoon Kheong LeongManoj BalakrishnanZunyu Guan
- A novel approach to mitigate stress induced defects at metal-dielectric interface in Redistribution layers for 3D IC stackingAmit KumarJose ChaconPeter GelzinisJulio MorrisAnkineedu Velaga
- Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational TemperaturesTatsushi HayashiPo Yu LinRyoichi WatanabeSeiko Ichikawa
- Wireless Sensor Platform for Nanosensor Interface ElectronicsBruce KimAnurag GuptaMitchell Spryn
- Two-Layer Solder Resist Film with Low Young’s Modulus for High ReliabilityYingHsuan ChouDaichi OkamotoHidekazu Miyabe
- Methods to Reduce the Hierarchy of Interconnections in Electronic SystemDyi-Chung HuJames Ho
- Advanced Die-Beam Alignment Method for Laser-Assisted BondingWagno Alves BragancaKim KyungOe
- Advanced Low Df Dry film Build-up Material on Glass panel for 5G applicationTakenori KakutaniZhong GuanYuya SuzukiMuhammad AliSerhat ErdoganAtom WatanabeMohanalingam KathaperumalMadhavan Swaminathan
- Ultra-thin Flip-Chip Assembly for Heterogenous and Hybrid IntegrationDouglas HacklerEdward Prack
- Optimizing X-Ray Inspection for Advanced Packaging ApplicationsBrennan PetersonMichael KwanFred DuewerAndrew ReidRhiannon Brooks
- Lithium Battery Cell Level Fusing with Aluminum Heavy Wire BondsUtkarsh MehrotraArthur BrazzleMichael McKeownDouglas C. Hopkins
- Heterogeneous System-In-Package (HSIP) TechnologyCharles WoychikRobert MundellaKeith KunardVictor VilarJustin BorskiRobert Nead
- Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous IntegrationJohn H LauCheng-Ta KoChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinJJ ChenPo-Chun HuangTzvy-Jang TsengEagle LinLeo ChangCurry LinWinnie Lu
- Six-Side Molded Panel-Level Chip Scale Package with Multiple Diced WafersJohn H LauCheng-Ta KoTzvy-Jang TsengChia-Yu PengKai-Ming YangTim XiaPuru Bruce LinEagle LinLeo ChangHsing Ning LiuCurry LinDavid ChengWinnie Lu
- Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level PackagingYuji OkadaAtsushi FujiiKenta OnoYoshiharu Kariya
- Optical Data Link Module for Data Transmission in Smart CathetersJian LiVincent HennekenMarcus LouwerseRonald Dekker
Hu, Dyi-Chung, and James Ho. 2020. “Methods to Reduce the Hierarchy of Interconnections in Electronic System.” IMAPSource Proceedings 2020 (1): 156–59. https://doi.org/10.4071/2380-4505-2020.1.000156.