This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:16757/feed
ISSN 2380-4505
Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module

Tzu-Hsuan Cheng, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, Douglas C. Hopkins,
Double-sided coolingepoxy-resin composite dielectrichalf-bridge power modulepower electronic packagingthermal modelingthermal via optimization
https://doi.org/10.4071/2380-4505-2020.1.000277
IMAPSource Conference Papers
Cheng, Tzu-Hsuan, Kenji Nishiguchi, Yoshi Fukawa, B. Jayant Baliga, Subhashish Bhattacharya, and Douglas C. Hopkins. 2020. “Characterization of Highly Thermally Conductive Organic Substrates for a Double-Sided Cooled Power Module.” IMAPSource Proceedings 2020 (1): 277–81. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000277.

View more stats

Powered by Scholastica, the modern academic journal management system