ISSN 2380-4505
Vol. 2020, Issue 1, 2020September 01, 2020 EDT
The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu films
The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu films
Bernhard, Tobias, Sebastian Zarwell, Edith Steinhäuser, Stefan Kempa, and Frank Brüning. 2020. “The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films.” IMAPSource Proceedings 2020 (1): 291–97. https://doi.org/10.4071/2380-4505-2020.1.000291.