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Symposium Proceedings
Vol. 2017, Issue 1, 2017
October 01, 2017 EDT
A novel production process for 10 μm microvias.
Abdelghani Renbi
,
Jerker Delsing
,
Microvia
Electronics packaging
PCB interconnect
Laser drilling
Wire Bonding
SBU
HDI
Wafer Level Packaging
•
https://doi.org/10.4071/isom-2017-WP53_078
IMAPSource Conference Papers
Renbi, Abdelghani, and Jerker Delsing. 2017. “A Novel Production Process for 10 Μm Microvias.”
IMAPSource Proceedings
2017 (1): 468–72.
https://doi.org/10.4071/isom-2017-WP53_078
.
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