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Symposium Proceedings
Vol. 2017, Issue 1, 2017October 01, 2017 EDT

A novel production process for 10 μm microvias.

Abdelghani Renbi, Jerker Delsing,
MicroviaElectronics packagingPCB interconnectLaser drillingWire BondingSBUHDIWafer Level Packaging
https://doi.org/10.4071/isom-2017-WP53_078
IMAPSource Conference Papers
Renbi, Abdelghani, and Jerker Delsing. 2017. “A Novel Production Process for 10 Μm Microvias.” IMAPSource Proceedings 2017 (1): 468–72. https:/​/​doi.org/​10.4071/​isom-2017-WP53_078.
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