ISSN 2380-4505
Morard, Adrien, Jean-Christophe Riou, and Gabriel Pares. 2017. “Flip Chip Reliability and Design Rules for SIP Module.” IMAPSource Proceedings 2017 (1): 754–60. https://doi.org/10.4071/isom-2017-THP43_125.
We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.
Enter the URL below into your favorite RSS reader.
http://localhost:21394/feed