Wire Bonding Looping Solutions for High Density System-in-Package (SiP)

Milton, Basil, Odal Kwon, Cuong Huynh, Ivy Qin, and Bob Chylak. 2017. “Wire Bonding Looping Solutions for High Density System-in-Package (SiP).” IMAPSource Proceedings 2017 (1): 426–31. https:/​/​doi.org/​10.4071/​isom-2017-WP41_151.