ISSN 2380-4505
Articles in Vol. 2017, Issue 1, 2017
Vol. 2017, Issue 1, 2017
- Electrochemical Analysis of Aged Copper Plating Bath in Wafer Level Packaging (Part 1)Michael PavlovDanni LinEugene Shalyt
- Nondestructive Imaging of Packaged Microelectronics using Pulsed Terahertz TechnologyTyler BowmanMagda El-Shenawee
- Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool DesignPaul EichwaldSimon AlthoffReinhard SchemmelWalter SextroAndreas UngerMichael BrökelmannMatthias Hunstig
- Fine Resolution Photosensitive Polyimide Dry Film with High Resistance to Electromigration under HAST conditionMasao TomikawaKazuyuki MatsumuraYu ShojiYoshiko TatsutaRyoji Okuda
- Highly Reliable Cu Wiring Layer of 1/1 μm Line/Space Using Newly Designed Insulation Barrier FilmKazuyuki MitsukuraShinichiro AbeMasaya TobaTomonori MinegishiKazuhiko Kurafuchi
- Journey to Success for New Analog Technologies for Texas InstrumentsMario MagañaBasab ChatterjeeRey Javier
- Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)John LauMing LiNelson FanEric KuahZhang LiKim Hwee TanTony ChenIris XuMargie LiY. M. CheungWu KaiJi HaoRozalia BeicaTom TaylorCT KoHenry YangYH ChenSze Pei LimNC LeeJiang RanKoh Sau WeeQingxiang YongCao XiMian TaoJeffery LoRicky Lee
- Reduction of Thermal Stress - Part I: Passivation Thickness Optimization of Standard Surface Bump DesignRaj Sekar SethuSalil Hari KulkarniHow Ung HaKok Heng Soon
- Durability and Reliability of Electro-Mechanical Relays for Oil and GasSaeed RafieYoussef Boulaknadal
- Lighting System Packaging for Smart Underwater Reefs for Sensing, Communications, and RoboticsDavid FriesConnor TateTim HutchesonNoam JosefDavid Millie
- Automotive IC probing challenges –FFI MEMS Technology meets and exceeds expectationAshish BhardwajAmy Leong
- Next Generation Xeon Server Package ArchitectureRaja SwaminathanRam ViswanathSriram SrinivasanArun Chandrasekhar
- High Density, Tall Cu Pillars for 3D PackagingTom SwarbrickKevin MartinKousuki Mori
- Encapsulation of Microelectronic Assemblies for use in Harsh EnvironmentsH. VarnerJ. MahaffeyT. MarinisC. DiBiasio
- Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using LaserKwang-Seong ChoiWagno Alves BragancaKeon-Soo JangHyun-Cheol BaeYong-Sung Eom
- Investigation of Wafer Level Packaging schemes for 3D RF interposer multi-chip moduleBart VereeckePhilippe SoussanJian Zhu
- Aluminum Wedge-Wedge Bonding Using Capillary and Ball BonderSarangapani MuraliEi Phyu Phyu TheintHamdan Faizul FitriTan Kean TiongZhang Xi
- Dark Current Leakage in Optoelectronic Hermetic PackagesClara DionetGoran PerosevicJeff JavierSammie FernandezTaylor HurdleMaziar MoradiAndrew NeelyKevin MaMarwan Albarghouti
- Using SPICE to Model Nonlinearities Resulting from Heterogeneous Integration of Complex SystemsAubrey N. BealRobert N. Dean
- Investigation of Package Effects on the Edge Termination E-Field for HV WBG Power SemiconductorsHaotao KeYifan JiangAdam J. MorganDouglas C. Hopkins
- Plasma Dicing Process-Flows for Advanced Packaging FabricationsFrank WeiTomotaka TabuchiHideyuki Sando
- Reduction of Thermal Stress - Part II: Passivation Thickness Optimization of FLATPV Surface Bump DesignRaj Sekar SethuSalil Hari KulkarniHow Ung HaKok Heng Soon
- Operation of Silicon Carbide Integrated Circuits under High Temperature and PressureM. BarlowA. M. FrancisJ. Holmes
- Glass Solutions for Packaging and IoTRachel LuAric Shorey
- 3D Printed Integrated Microfluidic Cooling for High Power RF ApplicationsMichael CratonMohd Ifwat Mohd GhazaliBrian WrightKyoung Youl ParkPremjeet ChahalJohn Papapolymerou
- Reinforced Solder Technology for Increased ReliabilityTim JensenSunny NeohAdam Murling
- High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant AdhesivesMary LiuWusheng Yin
- Supply Chain Hardware Integrity for Electronics Defense (SHIELD) Using Small “Dielets”Len ChorosinskiVenky SundaramKlaus WolterRichard CalatayudParrish RalstonScott SukoDavid FryNathanael Ellerhoff
- Embedded Passive Circuit Elements in Low Temperature Co-Fired Ceramic Substrates for Aerospace ElectronicsDevin A. SmarraGuru SubramanyamVamsy P. ChodavarapuSivaram P. GogineniKenneth J. SemegaAlireza R. Behbahani
- Microfabrication and Packaging Process for a Single-Chip Position, Navigation, and Timing SystemJunjun HuanVamsy P. ChodavarapuGeorge XereasCharles Allan
- A Generic Strategy to Assess and Mitigate Chip Package Interaction Risk Factors for Semiconductor Devices with Ultra-low k Dielectric Materials in Back End of LineFrank KuechenmeisterDirk BreuerHolm GeislerChristian KlewerBjoern BoehmeKashi Vishwanath MachaniMichael HeckerChristian GoetzeJae Kyu ChoHimani KamineniJens PaulMichael Thiele
- Reliability of Coated and Alloyed Copper/Silver Ball BondsSarangapani MuraliBayaras Abito DanilaZhang Xi
- Rapid Prototyping Tape Stencils for the Application of Solder PasteMimi X. YangKaren DowlingDebbie SeneskyH.-S. Philip Wong
- Temperature and Process Dependent Material Characterization and Multiscale Stress Evolution Analysis for Performance and Reliability Management under Chip Package InteractionAditya P. KarmarkarXiaopeng XuKarim El-Sayed
- Electrical Chip-Board Interaction (e-CBI) of Wafer Level Packaging TechnologyWei ZhaoMark NakamotoKarthikeyan DhandapaniBrian HendersonRon LindleyRiko RadojcicUrmi RayAurel GunterusMark SchwarzAhmer SyedVidhya Ramachandran
- Strength assessment for direct-sintered Al2O3-to-Cu joints based on damage modelingAdrian LisKoji AsamaTomoki MatsudaTomokazu SanoAkio Hirose
- Direct Aerosol Printing of Lithium-ion BatteriesXiaowei YuI-Meng ChenSusmita SarkarJonghyun ParkHeng PanYangtao LiuYan WangWesley Everhart
- Morphological and Electrical Stability Studies of Pt/Yttria-Stabilized Zirconia Nanocomposite Thin Film Cathodes for Microfabricated Solid Oxide Fuel CellsMichael RottmayerRaj SinghHong Huang
- A Critical Review of Wirebond Visual Inspection CriteriaThomas Green
- Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and Photosensitive Dry Film Polymer DielectricsVenky SundaramFuhan LiuChandra NairRao TummalaAtsushi KuboTomoyuki AndoKeith BestCorey Shay
- Challenges of Large Format Packaging and Some of Its Assembly SolutionsTH Eric KuahHao Ji YuanCatherine ChanWu KaiNelson FanLi MingJohn LauEric NgMargie Li
- Direct Measurement of Silicon Strain in a Fine Pitch Flip Chip BGA PackageNathan WhitchurchGlenn RinneWei LinDevarajan Balaraman
- Non-Destructive Testing for System-in-Package Integrity AnalysisKarl-Friedrich BeckerMathias MinkusJeremias PaulsVolker BaderSteve VogesTanja BraunGerd JungmannHubert WieserM. Schneider-RamelowK.-D. Lang
- 3D Printed Metalized Plastic Waveguides for Microwave ComponentsMohd Ifwat Mohd GhazaliKyoung Youl ParkVincens GjokajAmanpreet KaurPremjeet Chahal
- RF Test Article to Assess the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical AssembliesJoshua S. PetkoPhilip A. LovellJeremy D. CliftonPaul H. CohenKarl F. Schoch
- Co-Simulation Based Multi-Chip Module Design Flow and Wi-Fi Module Example with Integrated BAW and LNAJeff DekoskyDeepukumar NairLarry CarastroScott Knapp
- The IC in the Flexible Hybrid Electronics Technology: Flexibility and Bend TestingVal R. Marinov
- Fine Line Routing and Micro via Patterning in ABF Enabled by Excimer Laser AblationHabib HichriShohei FujishimaSeongkuk LeeMarkus ArendtShigeo Nakamura
- A Secure Tunable LNA Design for Internet of ThingsBruce KimSang-Bock Cho
- RELIABILITY; WHAT'S RIGHT FOR YOUR BUSINESS?Rita Mohanty
- Antenna Systems for Simultaneous Transmit and Receive (STAR) ApplicationsEhab A. EtellisiMohamed A. ElmansouriDejan S. Filipovic
- OPTIMIZATION OF CHEMISTRY FOR A VAPOUR PHASE PROCESS TO DEFLUX NO CLEAN LEAD FREE MATERIALS ON PCBSPatrick J. DuchiJonathan CetierLaurent LevasseurJaquemine CoquioRodrigo Aguilar
- Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene ProcessRobert GernhardtFriedrich MüllerMarkus WoehrmannHabib HichriKarin HauckMichael ToepperMarkus ArendtKlaus-Dieter Lang
- Thermally Stable Ag-Ag Joints Bonded by Ultrasound-assisted Stress Migration BondingHao ZhangNorio AsataniYukiharu KimotoAiji SuetakeShijo NagaoTohru SugaharaKatsuaki Suganuma
- A novel production process for 10 μm microvias.Abdelghani RenbiJerker Delsing
- Packaging and Miniaturization of a 2–18 GHz UWB Radar for Measurements of Snow and Ice: Initial ResultsF. R. MoralesC. LeuschenA. FeathersJ. McDanielA. WolfS. Garrison
- Die Placement Error management for Fan out Applications using Projection LithographyHabib HichriMo AbdolMarkus Arendt
- Using a Metal Oxide Adhesion Layer and Wet Chemical Cu Metallization for Fine Line Pattern Formation on GlassMichael MerschkyFabian MichalikMartin ThomsRobin TaylorDiego Reinoso-CocinaStephan HotzPatrick Brooks
- Multi-factor product authentication using integrated Quick Response (QR) code pixelated antennaJohn DoroshewitzAmanpreet KaurJeffrey NanzerPremjeet Chahal
- Environmentally Isolating Packaging for MEMS SensorsMichael KranzMichael WhitleyCarl RuddJeff D. CravenSteven D. ClarkRobert N. DeanGeorge T. Flowers
- Development of Liquid Compression Molding (LCM) Material for Low WarpageTsuyoshi KamimuraSatomi KawamotoDaisuke HashimotoYuto ShigenoHaruyuki YoshiiHirokazu NomaTomohiro OokuboHisato TakahashiHidetoshi Inoue
- Innovative Integration Solutions for SiP Packages Using Fan-Out Wafer Level eWLB TechnologyJacinta Aman LimVinayak Pandey
- High Current Testing and Simulation for Land Grid Array SocketsBrian BeamanJean Audet
- Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability StressesNishant LakheraSandeep ShantaramAR Nazmus Sakib
- A Frequency Swept Low-Cost Capacitive Fringing Field PCB SensorRobert N. Dean
- 14nm Chip Package Interaction (CPI) Technology DevelopmentLei FuYS LowMilind BhagavatIvor Barber
- In-line advanced process control solution for the fabrication of micro-bumpsDario AlliataStephane GodnyCleonisse SerrecchiaTristan CombierAstrid SippelPhilippe Gastaldo
- Implementation of Wafer Level Packaging KOZ using SU-8 as Dielectric for the Merging of WL Fan Out to Microfluidic and Biomedical ApplicationsAndré CardosoRaquel PintoElisabete FernandesSteffen Kroehnert
- Surviving the Heat Wave – A presentation on thermally induced failures and reliability risks created by advancements in electronics technologiesGreg Caswell
- Prototyping and Production of High-temperature Power Electronic Substrates through Additive Manufacturing ProcessesThomas StollAarief Syed-KhajaJoerg Franke
- Investigation & Resolution of Current Leakage Failure caused by Carbon Black Aggregation in Mold CompoundAkhilesh Kumar SinghTeck Beng LauNishant LakheraHoffmann JamesBoon Yew Low
- High Temperature Storage Reliability of Bond Resistance of Palladium-Coated Copper Ball BondsMichael David HookMichael MayerStevan Hunter
- Fabrication of X-band Oscillator on LCP Substrate Using Aerosol PrintingChristopher OakleyPremjeet ChahalJohn PapapolymerouJohn D. Albrecht
- Modeling Vibration Induced Fatigue Failure of Free Standing Wire BondsZhenzhen ShenJames StoreyOtto FaniniMichael Osterman
- INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIESG. ParesJ.-P. MichelE. DeschaseauxV. PerninA. GiryP. FerrisA. Serhan
- Fully Printed Static Gain Reconfigurable Conformal Patch Antenna ArraysNolan GrantMahdi HaghzadehAlkim Akyurtlu
- Characterizations of Fan-out Wafer-Level PackagingMing LiQingqian LiJohn LauNelson FanEric KuahWu KaiKen CheungZhang LiKim Hwee TanIris XuDong ChenRozalia BeicaCT KoHenry YangSze Pei LimJiang RanCao Xi
- Design of Experiments Approach to Evaluating the Reliability of System-in-Package AssembliesTimothy DittmanDavid EbnerAlex Bailey
- E-Band 4-Bit Phase Shifter using SP4T Flip Chip SwitchesJia-Chi Samuel ChiehAnh-Vu NguyenJason RowlandSatish Sharma
- High-Temperature Reliability of Wire Bonds on Thick FilmZhenzhen ShenAleksey Reiderman
- Direct sapphire to ceramic bonding for CMOS image sensor packaging using room temperature bonding technologyH. LundénA. MäättänenL. Murphy
- Power cycle reliability of SiC devices with metal-sinter die-attach and thermostable moldingShijo NagaoHirofumi FujitaAkio ShimoyamaShinya SekiHao ZhangKatsuaki Suganuma
- Reliability Analysis of a Wearable Sensor Patch (WSP) to Monitor ECG SignalsVarun SomanMark D. PoliksJames N. TurnerMark SchadtMichael ShayFrank Egitto
- Thermal and Viscoelastic Properties of Underfill Using hexagonal Boron Nitride (hBN) NanofillerS. A. RazgalehShyam Aravamudhan
- Separating Temporary Carrier from Large Thin Panel with Air JettingHao TangMy NguyenMing Yin
- Practical Application and Analysis of Lead-Free Solder on Chip-On-Flip-Chip SiP for Hearing AidsYoungtak LeeDoug Link
- Printed Wiring for High-Power Electric Devices by Using Ag-sinter pasteSeungjun NohChanyang ChoeChuantong ChenShijo NagaoKatsuaki Suganuma
- Inkjet and 3D Printing Technology for Fundamental Millimeter-Wave Wireless PackagingBijan K. TehraniRyan A. BahrManos M. Tentzeris
- Flip chip reliability and design rules for SIP moduleAdrien MorardJean-Christophe RiouGabriel Pares
- Multichip Module Planarity Requirements Derived From Solder Surface Tension ModelsThomas F. MarinisJoseph W. Soucy
- Technology Transfer for MEMS and Advanced Packaging: Precision Surface Preparation Innovatively Applied to Emerging TechnologiesBob Roberts
- 3D IPD on Thru Glass Via Substrate using panel Manufacturing TechnologyTakamasa TakanoSatoru KuramochiHobie Yun
- Multiphysics Performance Evaluation of Flexible Substrate Based 1.2kV SiC Half Bridge Intelligent Power Module with Stacked DiesXin ZhaoK. JagannadhamDouglas C. Hopkins
- Cost Comparison of Fan-out Wafer-Level Packaging to Embedded Die PackagingChet PaleskoAmy Lujan
- Experimental Assessment of Microwave Loss Caused by Non-Hexavalent Chromium-Based Conversion CoatingsJoshua S. PetkoPhilip A. LovellJeremy D. CliftonPaul H. CohenKarl F. Schoch
- Reliable Chip & Bond Wire QA Sampling, Counting & Inspection by Implementing Multiple Magnification AOIHector L. Fonseca
- Comparative Evaluation and Analysis of Gate Driver Impacts on a SiC MOSFET-Gate Driver Integrated Power ModuleLiqi ZhangSuxuan GuoPengkun LiuAlex Q. Huang
- LTCC Based Highly Integrated SiPM Module With Integrated Liquid Cooling Channels for High Resolution Molecular ImagingRainer DohleIlaria SaccoThomas RittwegThomas FriedrichGerold HenningJörg GoßlerPeter Fischer
- Thick Film Materials for High Power Hybrid Circuits on Aluminum NitrideMatt SgricciaFrank SandovalRyan Persons
- Planar Antenna for Terahertz Application in Fan Out Wafer Level PackageDaijiro IshibashiYoshihiro Nakata
- Characterization of Ultra-Thin Epoxy-Resin Based Dielectric Substrate for Flexible Power Electronics ApplicationsXin ZhaoK. JagannadhamWuttichai ReainthippayasakulMichael T. LanaganDouglas C. Hopkins
- Solderability and Reliability Evolution of No-Clean Solder Fluxes For Selective SolderingEmmanuelle GuénéRichard AniskoCéline Puechagut
- Building an EcoSystem for User-friendly Design of Advanced System in Package (SiP) SolutionsHerb Reiter
- The Relevance of Low Temperature Co-fired Ceramic Module Packaging in the 5G MarketTon Schless
- Additive Packaging for Microwave ApplicationsSusan TrulliCraig ArmientoChristopher LaightonElicia HarperMahdi HaghzadehAlkim Akyurtlu
- Atmospheric Probe for Real Time Weather MonitoringJ. Craig PratherMichael BoltHaley HarrellTyler HortonJohn ManobiancoMark L. Adams
- Wire Bonding Looping Solutions for High Density System-in-Package (SiP)Basil MiltonOdal KwonCuong HuynhIvy QinBob Chylak
- Relation between relative humidity and electrical performance of electrochromic displaysAlexandre GarciaHuiting JinKjell OlafsenSigbjørn KolbergDaniel Nilsen WrightMaaike M. Visser TakloAnnelie EvebornOlle HagelTorbjörn Eriksson
- Thin Film Capacitor Applications in RF/Microwave CircuitsWilliam B. KuhnJ. Ambrose Wolf
- Ultra-fine Cu Wiring Surrounded by Electroless-Plated Ni: Effective Structure for High Insulation Reliable Wiring Applicable to Panel Level FabricationMasaya TobaKazuyuki MitsukuraYoshinori EjiriTomonori MinegishiKazuhiko Kurafuchi
- Direct copper metallization on TGV (Thru-Glass-Via) for high performance glass substrateShigeo ONITAKEKotoku INOUEMasatoshi TAKAYAMA
- 2.5D FPGA-HBM Integration ChallengesJaspreet GandhiBoon AngTom LeeHenley LiuMyongseob KimHo Hyung LeeGamal Refai-AhmedHong ShiSuresh Ramalingam
- Enhanced In-Plane Heat Transport in Embedded Mini Heat Pipes PCBJonathan Silvano de SousaPaul FulmekMichael UngerPeter HaumerJohann NicolicsMohamad Abo RasDaniel May
- Next Generation Chip Embedding Technology for High Efficient Mid Power ModulesKay S. EssigCT ChiuJarris KuoPhidia ChenJean-Marc Yannou
- Design of 240°C Low Voltage Power SupplySaurabh Kulkarni
- Effective Inspection Methods for Advanced Packaging TechnologiesJulia BruecknerMichael SchwanderMoritz JurgschatRamon Tuason
- Development of Thinner POP Base Package by Die Embedded and RDL StructureMasahiro KyozukaTakahiko KisoHiroki ToyazakiKoichi TanakaTetsuya Koyama
- Shielding Effectiveness Simulation of SMT EMI Gaskets Utilizing ANSYS HFSSChristopher M. KerwienCharlotte Blair
- Integration and Miniaturization of a Ka-band Stepped Frequency Radar for Un-manned Aerial Vehicle ApplicationsJay W. McDanielMark B. YearyHjalti H. SigmarssonJ. Ambrose WolfSean GarrisonKyle ByersMatthew Clewell
- Stencil Print solutions for Advance Packaging ApplicationsPhani Vallabhajosyula
- Design for Reliability Analysis of Vibration-Induced Failures due to Equipment Assembly Bending Load and Vibration ResponsesJosh LiewOtto Fanini
- Ablative Laser Patterning of Polymeric Dielectric MaterialsCristina R. Matos-PérezDeborah BlumenshineLisa M. KirchnerTony FlaimRama PuligaddaHabib HichriMarkus ArendtSeongkuk Lee
- Characterization of Silicone Gel for High Temperature Encapsulation in High Voltage WBG Power ModulesAdam MorganXin ZhaoJason RouseDouglas Hopkins
- Ultra-Compact Four-Channel 5–18 GHz Switched Filter Bank Utilizing PolyStrata® Microfabrication and 3D PackagingChris HermansonRob ReidWill Stacy
- Alternative deposition solution for cost reduction of TSV integrationJ. VitielloF. PiallatL. Bonnet
- Silicon microfluidics: An enabling technology for life sciences applicationBivragh. MajeedLei ZhangGiuseppe FiorentinoGreet VerbinnenHuma AshrafEdward WalsbyKerry RobertsJafar Al KuzeeRhys DaweDave ThomasDeniz. Sabuncuoglu
- Reduction of Thermal Stress - Part III: UBM and Passivation Thickness OptimizationRaj Sekar SethuSalil Hari KulkarniHow Ung HaKok Heng Soon
- Photoresist Residue Detection in Advanced PackagingJonathan CohenWoo Young HanGurvinder SinghKeith BestAmy ShayMike Marshall
Trulli, Susan, Craig Armiento, Christopher Laighton, Elicia Harper, Mahdi Haghzadeh, and Alkim Akyurtlu. 2017. “Additive Packaging for Microwave Applications.” IMAPSource Proceedings 2017 (1): 768–72. https://doi.org/10.4071/isom-2017-THP53_148.