ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance Interposers
Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance Interposers
Articles in Vol. 2025, Issue Symposium, 2025
Vol. 2025, Issue Symposium, 2025
- Validating Reduced Order Model for Solder Reliability of Leadless Ceramic Chip Component during Temperature CyclingArvind PurushotamanNatalie RainesNathan Blattau
- RF-SiP Chip Package Interaction Finite Element AnalysisJiaping ZhangYonghao An
- Modeling Analysis of Passivation and TEOS Cracking in BEOL Metal Trace DesignWei WangKarthik DhandapaniYangyang Sun
- The Ideal Switch®: Glass-Based Device with Demonstrated ReliabilityAric ShoreyJoleyn BrewerChris NassarMatt Strohmayer
- Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware FingerprintingLiton Kumar BiswasM. Shafkat M. KhanHimanandhan Reddy KotturHao WangHamed DalirNavid Asadizanjani
- Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced PackagingHimanandhan Reddy KotturPavanbabu ArjunamahanthiM. Shafkat M. KhanLiton Kumar BiswasNitin VarshneyNavid Asadizanjani
- Warpage Analysis of Lidded Flip Chip CSP: Impact of Material Properties and DimensionsJun ChenMubsar DhukaSharan KishoreNishant LakheraJetse de WitteBetty Yeung
- Key Atmospheric Plasma Solutions Lead Reliable Hybrid BondingKelvin ChiuKuo-Chao LiangChun-Cheng WuWinson Hsu
- Evaluation of Au-Si Eutectic Die-Attach for Power Hermetic Packages in Space ApplicationsLi JiangRamlah RazakBlake TravisGuangxu LiKejun ZengRongwei ZhangMuhammad KhanRajen Murugan
- Enhancing Efficiency in Packaging Substrate Reliability Evaluation Through AC Electrical Resistivity MeasurementMing-chun HsiehAiji SuetakeMasahiko NishijimaHiroyoshi YoshidaRieko OkumuraHirokazu TanakaHiroki SetoHiroshi NishikawaKatsuaki Suganuma
- Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump PitchesChia-Wei ChangWen-Yu TengLiang-Yih HungYu-Cheng PaiAndrew KangYu-Po Wang
- FOWLP Automotive Grade Reliability Challenges and Solutions for Application Specific EnvironmentGaurav SharmaMichiel van SoestbergenGreta TerzariolAmar MavinkurveNishant Lakhera
- A New Optical Ball Grid Array Package Development for Automotive Optical SensorsWonBae BangWeilung LuAdrian ArcederaKiDong Sim
- Simplification of Via-first TSV and Backside Interconnect Process for Large-Scale Superconducting Quantum Annealing CircuitsNaoya WatanabeYuuki AragaAyuka MoriokaKunihiko IshiharaTomohiro NishiyamaKatsuya Kikuchi
- Developing a Non-Cyanide Gold Bath Free of Heavy Metals for Via-Fill ApplicationsDolores RossVeronica LambertHarshul KhannaAdam LetizeThomas RichardsonElie Najjar
- Submicron Au-Particle Bumps for High-Density Flip-Chip MountingYuichi MakitaAkihito FujinoNoriaki Nakamura
- Thermal Performance of High Thermal Conductivity TIM for Large Advanced Package through TTV Measurement and FEM Analysis ApproachShane LinVito LinAndrew KangY.P. Wang
- Core Crack Mitigation in Semiconductor Substrates: A Multi-Scale Simulation Approach to Design Organic Core Material PropertiesRimpei KindaichiMasaki TakahashiAtsuko UedaTakashi MasukoKosuke UrashimaKeita Johno
- SR-EMC Interface Analysis for Highly Reliable Automotive Packaging ApplicationsNatsuki ItoMayu FujimotoKayoko TokumitsuYuya SuzukiDaichi OkamotoDaisuke ShibataMasayuki Shimura
- Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case StudyKatayoon YahyaeiM. Shafkat M. KhanGuillermo CadimaHimanandhan Reddy KotturNavid Asadizanjani
- Prediction of Cross-Sectional Images and Proposing Processes with Neural NetworkKohei MotojimaHayato SugiyamaKaede AmeyamaChiho Ueta
- Novel Photo Imageable Film for RDL ApplicationMitsuya UchidaYasuyo KanazawaYuna KawataYusuke Naka
- Wafer Level Substrates with Si-Core and Hybrid Organic/Inorganic InterconnectSteven VerhaverbekeHan-Wen ChenSuresh RamalingamVineeth HarishSubramanian Iyer
- One-Step Wet Chemical Treatment for Fluxless Cu-Sn Thermocompression Microbump BondingRyo NegishiSatoshi SaitoKyoko ShimizuItsuro Tomatsu
- PFAS Free, High Reliability and Multisurface Die Attach for QFN PackagesAvin DhobleSenthil KanagavelElisia SiowTim Kuo
- Overcoming Cleaning Challenges for AI Devices: Optimizing a Cleaning Process for High ReliabilityHaley ReidMiller Armistead
- Panel RDL Interposer or Substrate (PRIS) for a Vertical-Cavity Surface-Emitting Laser (VCSEL)Chia-Yu PengKuang-Ping PanPuru Bruce LinYun-Cheng YangKai-Ming YangCheng-Ta KoJin-Sheng WangMike MaJohn H. LauTzong-Lin WuChao-Hsin Wu
- Innovative Digital Patterning by LITHOSCALE® XT for UHD FO WLP and HD PLP Required in 3D IntegrationKsenija VargaRoman HollyTobias ZengerBoris PovažayMatthias Brunnbauer
- Eco-Friendly, High-Performance Cellulose Acetate Encapsulation for Flexible Hybrid Electronics: Environmental Stability and Printing ScalabilityOlya Noruz ShamsianBabatunde FalolaAbdullah ObeidatRiadh Al-HaidariJordan Howard-JenningsBryan CabreraUdara SomarathnaMohammed AlhendiGurvinder Singh KhindaMatthew MisnerMark Poliks
- New Thermal Management & Flexible Heater Laminate Materials for ElectronicsMatthew ManelisMike KwasnyWhit Brown
- Measurements of Anisotropic Thermal Conductivity of a Multilayer Ceramic Substrate Over a Uniform Spatial DistributionLillie ClarkTom MarinisDavid Hanson
- Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced FailuresMasoud Rostami-AngasAshok AlagappanJiri DrozdaSreekanth Gondipalle
- Using UCIe Channel Compliance Simulation for Understanding Substrate/Interposer Design TradeoffsJohn CakaMatt LeslieRandy Wolff
- Fine-Pitch RDL with High Reliability Formed on Glass for Heterogeneous IntegrationTakamasa TakanoSatoru KuramochiHidetoshi IiokaTakao Shindou
- Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance InterposersDrew WeningerSamuel SernaLuigi RannoLionel KimerlingAnuradha Agarwal
- High-Performance PCB Materials for Next-Generation Electronics Packages, driving Signal Integrity, Power Handling, and ReliabilityJohn CoonrodLance BlaskowskiVitali JudinKarl SprentallMike Kuszaj
- Impact of Burnished and Brushed Surface Preparation on Gold Bond Pads: Bond Strength and Wire Bond Quality in MicroelectronicsMatteo Forgione
- Fine Pitch Vertical Wire BondingSarangapani MuraliDhayalan MariyappanSoh Jin Siong JoshuaLim Yee Weon EvonneTan Tze QingKang Sungsig SS
- Water Permeation Behavior in Polyimide Materials for Polymer Hybrid BondingKota NomuraMasaya JukeiYugo TanigakiKai IshigamiTakenori FujiwaraYu ShojiHitoshi Araki
- Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Manufacturing MethodRoghayeh ImaniShailesh ChouhanJerker Delsing
- Novel Optical Bumps using Graded Index Couplers for Flip-Chip Photonic PackagingDrew WeningerChristian DuesselSamuel SernaLionel KimerlingAnuradha Agarwal
- Novel Thin Dry Film Photoresist and Process Optimization for Ultra-Fine PatterningDaisuke SakiiSatoshi Kusaka
- FOWLP for Next-Generation Optical Switches: Scalable Packaging Solutions for Photonic-Electronic IntegrationMarius AdlerRobert GernhardtMarkus WöhrmannTanja BraunJeroen MissineHarindra Kumar KannojiaJef Van AschGeert Van SteenbergeSabrine MejriGyuhyeon Park
- Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced PackagingB. Senthil KumarZhang Rui FenZhang HanWenSS KangRavi Parthasarathy
- UCIe Full Signal Integrity Analysis Flow with Compliance Check for Heterogenous IntegrationShawn MillsKen Willis
- Enhancd Copper Adhesion on Glass Via Adhesion Promotion CoatingShuyang KaoYing-Hsuan YehSimon McElreaRoger TerrillSunity Sharma
- Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced PackagingDennis FiedlerGrigory VazheninHolger SchulzHenning HübnerTobias SponholzMustafa OezkoekHeeBum Shin
- Study of High Adhesion Plating Process Using Metal Oxide on Glass for Advanced PackagingKazuhiro HirookaHonoka NakagawaMayu TsukudaJun-ichi KatayamaToshimitsu Nagao
- 150 GHz-band Coreless High Multilayer Antenna-in-Package for 6GHiroshi TanedaNaoki KuroiwaYoshikazu KazamaKei MurayamaMakoto TsukaharaHiroko OtaYoko NakabayashiNoritaka KatagiriRyosuke HasabaKen TakahashiKenichi OkadaTakashi TomuraWatanabe Issei
- Cavity-backed Antennas using Quartz Glass on Silicon Hybrid Bonded Wafers for Sub-THz Communication and Radar ApplicationsUwe MaaßWojciech PartykaAlexander GäblerKentaro TaniNaotake OkadaMasato TokaiShoichiro YamaguchiJungo KondoMakoto IwaiIvan Ndip
- Laser Cleaning Cylindrical Cells for Optimum Wire BondabilityMike McKeownJack GilsonLouis CastellanosDirk SiepeTakaaki HigashiKentaro NakamuraDominik Haering
- Facilitating High-Reliability Cu-to-Cu Direct Bonding via Tunable Cu-selective Oxide suppression Coating for Advanced InterconnectsKevin Antony Jesu DuraiDinesh Kumar KumaravelKhanh Tuyet Anh TranDuwage Anushka Sandaruwan PereraHsing-Chien ChienPo-Wen ChiuKuei-Hsien ChenOliver Chyan
- Investigation of Cu-Cu Stitch Bonding Reliability on Cu Leadframe Substrate Using Ultrathin Cu-Selective PassivationShyam Muralidharan NairGavin FarmerJames AbrahamDuwage Anushka Sandaruwan PereraUsha PhiliposeOliver Chyan
- Development of an Ultra-Compact High-Voltage DC-DC Converter for Modular Sensor SystemsDincer SirkeciMartin HempelLukas Adrian BernertMartin Schneider-RamelowUlrike Ganesh
- Saras eVR STile - Demonstration of Next Generation Integrated Passives for Next Generation AI & HPC Power Delivery Network DesignsBartlet DeProspoEelco Bergman
- BEOL Film Crack Mechanical Reliability MitigationYutaka SuzukiJaimal WilliamsonTom KronenbergFrancis OyebanjoMadison MonzingoUsman ChaudhryRajen Murugan
- Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor PackagingNing LiuShahram SeyedmohammadiHoward YunMatthew Tsai
- Module Stress Reduction for 2.5D TSV-based Heterogeneous PackageHoon JungQuan PhamBryce LukehartHaamid JuvaleMinKeon LeeJunOh BongHyungSang Park
- Additive Manufacturing of Interposers with Curved ViasTobias A. SchaedlerKayleigh A. PorterAlex C. YuSouren SoukiazianTrevor SasseErin S. WernickPhuong P. BuiJacob M. HundleyMark R. O’Masta
- Die Attach and Thermal Cycling of Additively Manufactured Quad Flat No Lead Die Daisy Chain on Curved Alumina SubstrateErik BusseMousa Al-ZaninaAbdullah ObeidatEmuobosan EnakerakpoWT AlshaibaniStephen GonyaMatthew ErdtmannAdrian PykeMark Poliks
- Electromigration Challenges in FCQFN Packaging: Impact of Solder Thickness and Shape on ReliabilityMin-Yan TsaiShan-Bo WangYung-Sheng LinChristophe ZinckAntonio ZuccaroG. Livio GobbatoChen-Chao WangChih-Pin Hung
- Sub-Micron Patterning & High-Aspect-Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink MetallizationSiyang LiuShuyang KaoRey CoSimon McElreaSunity SharmaRoger H. TerrillHongbin Yu
- Jet-Dispensing Process Development for a Novel Nano-Ag-Sinterpaste for Pressureless Sintering of Miniaturized Opto-Electronic ComponentsLinus Daniel StierMarc DreissigackerMathias KochKarl-Friedrich BeckerTanja BraunMartin Schneider-RamelowAdrian StelzerMartin WozniakJulien Hossain
- AI-Driven Thermal Mapping and Management in 3D Integrated Photonic CircuitsLiton Kumar BiswasKatayoon YahyaeiShajib GhoshM. Shafkat M. KhanHimanandhan Reddy KotturRayhane Ghane-MotlaghMahdi NikdastNavid Asadizanjani
- Inkjet Photoresist Printing for Semiconductor DevicesSergio Ivan Yanez SanchezTeodore StoilevskiValentyna PawlowskaLauriane MaillefortCynthia RichardCatherine Marsan-Loyer
Weninger, Drew, Samuel Serna, Luigi Ranno, Lionel Kimerling, and Anuradha Agarwal. 2025. “Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance Interposers.” IMAPSource Proceedings 2025 (Symposium): 242–48. https://doi.org/10.4071/001c.147207.