SR-EMC Interface Analysis for Highly Reliable Automotive Packaging Applications

Natsuki Ito; Mayu Fujimoto; Kayoko Tokumitsu; Yuya Suzuki; Daichi Okamoto; Daisuke Shibata; Masayuki Shimura

doi:10.4071/001c.147294

Ito, Natsuki, Mayu Fujimoto, Kayoko Tokumitsu, Yuya Suzuki, Daichi Okamoto, Daisuke Shibata, and Masayuki Shimura. 2025. “SR-EMC Interface Analysis for Highly Reliable Automotive Packaging Applications.” IMAPSource Proceedings 2025 (Symposium): 345–49. https://doi.org/10.4071/001c.147294.

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