ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
A New Optical Ball Grid Array Package Development for Automotive Optical Sensors
A New Optical Ball Grid Array Package Development for Automotive Optical Sensors
Articles in Vol. 2025, Issue Symposium, 2025
Vol. 2025, Issue Symposium, 2025
- Validating Reduced Order Model for Solder Reliability of Leadless Ceramic Chip Component during Temperature CyclingArvind PurushotamanNatalie RainesNathan Blattau
- RF-SiP Chip Package Interaction Finite Element AnalysisJiaping ZhangYonghao An
- Modeling Analysis of Passivation and TEOS Cracking in BEOL Metal Trace DesignWei WangKarthik DhandapaniYangyang Sun
- The Ideal Switch®: Glass-Based Device with Demonstrated ReliabilityAric ShoreyJoleyn BrewerChris NassarMatt Strohmayer
- Enhancing Co-packaging Optics Enabled Silicon Photonics Security Assurance Hardware FingerprintingLiton Kumar BiswasM. Shafkat M. KhanHimanandhan Reddy KotturHao WangHamed DalirNavid Asadizanjani
- Nanoelectromechanical Systems (NEMS) for Hardware Security in Advanced PackagingHimanandhan Reddy KotturPavanbabu ArjunamahanthiM. Shafkat M. KhanLiton Kumar BiswasNitin VarshneyNavid Asadizanjani
- Warpage Analysis of Lidded Flip Chip CSP: Impact of Material Properties and DimensionsJun ChenMubsar DhukaSharan KishoreNishant LakheraJetse de WitteBetty Yeung
- Key Atmospheric Plasma Solutions Lead Reliable Hybrid BondingKelvin ChiuKuo-Chao LiangChun-Cheng WuWinson Hsu
- Evaluation of Au-Si Eutectic Die-Attach for Power Hermetic Packages in Space ApplicationsLi JiangRamlah RazakBlake TravisGuangxu LiKejun ZengRongwei ZhangMuhammad KhanRajen Murugan
- Enhancing Efficiency in Packaging Substrate Reliability Evaluation Through AC Electrical Resistivity MeasurementMing-chun HsiehAiji SuetakeMasahiko NishijimaHiroyoshi YoshidaRieko OkumuraHirokazu TanakaHiroki SetoHiroshi NishikawaKatsuaki Suganuma
- Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump PitchesChia-Wei ChangWen-Yu TengLiang-Yih HungYu-Cheng PaiAndrew KangYu-Po Wang
- FOWLP Automotive Grade Reliability Challenges and Solutions for Application Specific EnvironmentGaurav SharmaMichiel van SoestbergenGreta TerzariolAmar MavinkurveNishant Lakhera
- A New Optical Ball Grid Array Package Development for Automotive Optical SensorsWonBae BangWeilung LuAdrian ArcederaKiDong Sim
- Simplification of Via-first TSV and Backside Interconnect Process for Large-Scale Superconducting Quantum Annealing CircuitsNaoya WatanabeYuuki AragaAyuka MoriokaKunihiko IshiharaTomohiro NishiyamaKatsuya Kikuchi
- Developing a Non-Cyanide Gold Bath Free of Heavy Metals for Via-Fill ApplicationsDolores RossVeronica LambertHarshul KhannaAdam LetizeThomas RichardsonElie Najjar
- Submicron Au-Particle Bumps for High-Density Flip-Chip MountingYuichi MakitaAkihito FujinoNoriaki Nakamura
- Thermal Performance of High Thermal Conductivity TIM for Large Advanced Package through TTV Measurement and FEM Analysis ApproachShane LinVito LinAndrew KangY.P. Wang
- Core Crack Mitigation in Semiconductor Substrates: A Multi-Scale Simulation Approach to Design Organic Core Material PropertiesRimpei KindaichiMasaki TakahashiAtsuko UedaTakashi MasukoKosuke UrashimaKeita Johno
- SR-EMC Interface Analysis for Highly Reliable Automotive Packaging ApplicationsNatsuki ItoMayu FujimotoKayoko TokumitsuYuya SuzukiDaichi OkamotoDaisuke ShibataMasayuki Shimura
- Design Guidelines for In-line X-ray Inspection in Advanced Packaging Technology: A CoWoS Case StudyKatayoon YahyaeiM. Shafkat M. KhanGuillermo CadimaHimanandhan Reddy KotturNavid Asadizanjani
- Prediction of Cross-Sectional Images and Proposing Processes with Neural NetworkKohei MotojimaHayato SugiyamaKaede AmeyamaChiho Ueta
- Novel Photo Imageable Film for RDL ApplicationMitsuya UchidaYasuyo KanazawaYuna KawataYusuke Naka
- Wafer Level Substrates with Si-Core and Hybrid Organic/Inorganic InterconnectSteven VerhaverbekeHan-Wen ChenSuresh RamalingamVineeth HarishSubramanian Iyer
- One-Step Wet Chemical Treatment for Fluxless Cu-Sn Thermocompression Microbump BondingRyo NegishiSatoshi SaitoKyoko ShimizuItsuro Tomatsu
- PFAS Free, High Reliability and Multisurface Die Attach for QFN PackagesAvin DhobleSenthil KanagavelElisia SiowTim Kuo
- Overcoming Cleaning Challenges for AI Devices: Optimizing a Cleaning Process for High ReliabilityHaley ReidMiller Armistead
- Panel RDL Interposer or Substrate (PRIS) for a Vertical-Cavity Surface-Emitting Laser (VCSEL)Chia-Yu PengKuang-Ping PanPuru Bruce LinYun-Cheng YangKai-Ming YangCheng-Ta KoJin-Sheng WangMike MaJohn H. LauTzong-Lin WuChao-Hsin Wu
- Innovative Digital Patterning by LITHOSCALE® XT for UHD FO WLP and HD PLP Required in 3D IntegrationKsenija VargaRoman HollyTobias ZengerBoris PovažayMatthias Brunnbauer
- Eco-Friendly, High-Performance Cellulose Acetate Encapsulation for Flexible Hybrid Electronics: Environmental Stability and Printing ScalabilityOlya Noruz ShamsianBabatunde FalolaAbdullah ObeidatRiadh Al-HaidariJordan Howard-JenningsBryan CabreraUdara SomarathnaMohammed AlhendiGurvinder Singh KhindaMatthew MisnerMark Poliks
- New Thermal Management & Flexible Heater Laminate Materials for ElectronicsMatthew ManelisMike KwasnyWhit Brown
- Measurements of Anisotropic Thermal Conductivity of a Multilayer Ceramic Substrate Over a Uniform Spatial DistributionLillie ClarkTom MarinisDavid Hanson
- Multiphysics Approach to Reliability Prediction of Integrated Circuits Due to Radiation Induced FailuresMasoud Rostami-AngasAshok AlagappanJiri DrozdaSreekanth Gondipalle
- Using UCIe Channel Compliance Simulation for Understanding Substrate/Interposer Design TradeoffsJohn CakaMatt LeslieRandy Wolff
- Fine-Pitch RDL with High Reliability Formed on Glass for Heterogeneous IntegrationTakamasa TakanoSatoru KuramochiHidetoshi IiokaTakao Shindou
- Fabrication and Packaging of Edge Coupled Silicon Nitride Photonic Integrated Circuits on Glass Substrates for High Performance InterposersDrew WeningerSamuel SernaLuigi RannoLionel KimerlingAnuradha Agarwal
- High-Performance PCB Materials for Next-Generation Electronics Packages, driving Signal Integrity, Power Handling, and ReliabilityJohn CoonrodLance BlaskowskiVitali JudinKarl SprentallMike Kuszaj
- Impact of Burnished and Brushed Surface Preparation on Gold Bond Pads: Bond Strength and Wire Bond Quality in MicroelectronicsMatteo Forgione
- Fine Pitch Vertical Wire BondingSarangapani MuraliDhayalan MariyappanSoh Jin Siong JoshuaLim Yee Weon EvonneTan Tze QingKang Sungsig SS
- Water Permeation Behavior in Polyimide Materials for Polymer Hybrid BondingKota NomuraMasaya JukeiYugo TanigakiKai IshigamiTakenori FujiwaraYu ShojiHitoshi Araki
- Scalable Manufacturing of Multi-Stacked Copper Spiral Inductors Using a Novel Fully Additive Manufacturing MethodRoghayeh ImaniShailesh ChouhanJerker Delsing
- Novel Optical Bumps using Graded Index Couplers for Flip-Chip Photonic PackagingDrew WeningerChristian DuesselSamuel SernaLionel KimerlingAnuradha Agarwal
- Novel Thin Dry Film Photoresist and Process Optimization for Ultra-Fine PatterningDaisuke SakiiSatoshi Kusaka
- FOWLP for Next-Generation Optical Switches: Scalable Packaging Solutions for Photonic-Electronic IntegrationMarius AdlerRobert GernhardtMarkus WöhrmannTanja BraunJeroen MissineHarindra Kumar KannojiaJef Van AschGeert Van SteenbergeSabrine MejriGyuhyeon Park
- Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced PackagingB. Senthil KumarZhang Rui FenZhang HanWenSS KangRavi Parthasarathy
- UCIe Full Signal Integrity Analysis Flow with Compliance Check for Heterogenous IntegrationShawn MillsKen Willis
- Enhancd Copper Adhesion on Glass Via Adhesion Promotion CoatingShuyang KaoYing-Hsuan YehSimon McElreaRoger TerrillSunity Sharma
- Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced PackagingDennis FiedlerGrigory VazheninHolger SchulzHenning HübnerTobias SponholzMustafa OezkoekHeeBum Shin
- Study of High Adhesion Plating Process Using Metal Oxide on Glass for Advanced PackagingKazuhiro HirookaHonoka NakagawaMayu TsukudaJun-ichi KatayamaToshimitsu Nagao
- 150 GHz-band Coreless High Multilayer Antenna-in-Package for 6GHiroshi TanedaNaoki KuroiwaYoshikazu KazamaKei MurayamaMakoto TsukaharaHiroko OtaYoko NakabayashiNoritaka KatagiriRyosuke HasabaKen TakahashiKenichi OkadaTakashi TomuraWatanabe Issei
- Cavity-backed Antennas using Quartz Glass on Silicon Hybrid Bonded Wafers for Sub-THz Communication and Radar ApplicationsUwe MaaßWojciech PartykaAlexander GäblerKentaro TaniNaotake OkadaMasato TokaiShoichiro YamaguchiJungo KondoMakoto IwaiIvan Ndip
- Laser Cleaning Cylindrical Cells for Optimum Wire BondabilityMike McKeownJack GilsonLouis CastellanosDirk SiepeTakaaki HigashiKentaro NakamuraDominik Haering
- Facilitating High-Reliability Cu-to-Cu Direct Bonding via Tunable Cu-selective Oxide suppression Coating for Advanced InterconnectsKevin Antony Jesu DuraiDinesh Kumar KumaravelKhanh Tuyet Anh TranDuwage Anushka Sandaruwan PereraHsing-Chien ChienPo-Wen ChiuKuei-Hsien ChenOliver Chyan
- Investigation of Cu-Cu Stitch Bonding Reliability on Cu Leadframe Substrate Using Ultrathin Cu-Selective PassivationShyam Muralidharan NairGavin FarmerJames AbrahamDuwage Anushka Sandaruwan PereraUsha PhiliposeOliver Chyan
- Development of an Ultra-Compact High-Voltage DC-DC Converter for Modular Sensor SystemsDincer SirkeciMartin HempelLukas Adrian BernertMartin Schneider-RamelowUlrike Ganesh
- Saras eVR STile - Demonstration of Next Generation Integrated Passives for Next Generation AI & HPC Power Delivery Network DesignsBartlet DeProspoEelco Bergman
- BEOL Film Crack Mechanical Reliability MitigationYutaka SuzukiJaimal WilliamsonTom KronenbergFrancis OyebanjoMadison MonzingoUsman ChaudhryRajen Murugan
- Advanced Modeling of Cure Shrinkage and Viscoelasticity for Warpage Prediction on Image Sensor PackagingNing LiuShahram SeyedmohammadiHoward YunMatthew Tsai
- Module Stress Reduction for 2.5D TSV-based Heterogeneous PackageHoon JungQuan PhamBryce LukehartHaamid JuvaleMinKeon LeeJunOh BongHyungSang Park
- Additive Manufacturing of Interposers with Curved ViasTobias A. SchaedlerKayleigh A. PorterAlex C. YuSouren SoukiazianTrevor SasseErin S. WernickPhuong P. BuiJacob M. HundleyMark R. O’Masta
- Die Attach and Thermal Cycling of Additively Manufactured Quad Flat No Lead Die Daisy Chain on Curved Alumina SubstrateErik BusseMousa Al-ZaninaAbdullah ObeidatEmuobosan EnakerakpoWT AlshaibaniStephen GonyaMatthew ErdtmannAdrian PykeMark Poliks
- Electromigration Challenges in FCQFN Packaging: Impact of Solder Thickness and Shape on ReliabilityMin-Yan TsaiShan-Bo WangYung-Sheng LinChristophe ZinckAntonio ZuccaroG. Livio GobbatoChen-Chao WangChih-Pin Hung
- Sub-Micron Patterning & High-Aspect-Ratio Structures in Advanced Substrates with Dry Etching and Liquid Metal Ink MetallizationSiyang LiuShuyang KaoRey CoSimon McElreaSunity SharmaRoger H. TerrillHongbin Yu
- Jet-Dispensing Process Development for a Novel Nano-Ag-Sinterpaste for Pressureless Sintering of Miniaturized Opto-Electronic ComponentsLinus Daniel StierMarc DreissigackerMathias KochKarl-Friedrich BeckerTanja BraunMartin Schneider-RamelowAdrian StelzerMartin WozniakJulien Hossain
- AI-Driven Thermal Mapping and Management in 3D Integrated Photonic CircuitsLiton Kumar BiswasKatayoon YahyaeiShajib GhoshM. Shafkat M. KhanHimanandhan Reddy KotturRayhane Ghane-MotlaghMahdi NikdastNavid Asadizanjani
- Inkjet Photoresist Printing for Semiconductor DevicesSergio Ivan Yanez SanchezTeodore StoilevskiValentyna PawlowskaLauriane MaillefortCynthia RichardCatherine Marsan-Loyer
Bang, WonBae, Weilung Lu, Adrian Arcedera, and KiDong Sim. 2025. “A New Optical Ball Grid Array Package Development for Automotive Optical Sensors.” IMAPSource Proceedings 2025 (Symposium): 49–53. https://doi.org/10.4071/001c.147100.