ISSN 2380-4505
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT
Die Attach and Thermal Cycling of Additively Manufactured Quad Flat No Lead Die Daisy Chain on Curved Alumina Substrate
Die Attach and Thermal Cycling of Additively Manufactured Quad Flat No Lead Die Daisy Chain on Curved Alumina Substrate
Erik Busse, Mousa Al-Zanina, Abdullah Obeidat, Emuobosan Enakerakpo, WT Alshaibani, Stephen Gonya, Matthew Erdtmann, Adrian Pyke, Mark Poliks,
Busse, Erik, Mousa Al-Zanina, Abdullah Obeidat, Emuobosan Enakerakpo, WT Alshaibani, Stephen Gonya, Matthew Erdtmann, Adrian Pyke, and Mark Poliks. 2025. “Die Attach and Thermal Cycling of Additively Manufactured Quad Flat No Lead Die Daisy Chain on Curved Alumina Substrate.” IMAPSource Proceedings 2025 (Symposium): 82–88. https://doi.org/10.4071/001c.147109.