Submicron Au-Particle Bumps for High-Density Flip-Chip Mounting

Yuichi Makita; Akihito Fujino; Noriaki Nakamura

doi:10.4071/001c.147096

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Makita, Yuichi, Akihito Fujino, and Noriaki Nakamura. 2025. “Submicron Au-Particle Bumps for High-Density Flip-Chip Mounting.” IMAPSource Proceedings 2025 (Symposium): 29–32. https://doi.org/10.4071/001c.147096.

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