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ISSN 2380-4505
Symposium Proceedings
Vol. 2025, Issue Symposium, 2025November 10, 2025 EDT

Fine Pitch Vertical Wire Bonding

Sarangapani Murali, Dhayalan Mariyappan, Soh Jin Siong Joshua, Lim Yee Weon Evonne, Tan Tze Qing, Kang Sungsig SS,
Fine pitch bondinghalf-cut capillaryvertical wire bondingstacked devicesvertical wire post height
https://doi.org/10.4071/001c.147196
IMAPSource Conference Papers
Murali, Sarangapani, Dhayalan Mariyappan, Soh Jin Siong Joshua, Lim Yee Weon Evonne, Tan Tze Qing, and Kang Sungsig SS. 2025. “Fine Pitch Vertical Wire Bonding.” IMAPSource Proceedings 2025 (Symposium): 181–85. https:/​/​doi.org/​10.4071/​001c.147196.

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