Enhancing Efficiency in Packaging Substrate Reliability Evaluation Through AC Electrical Resistivity Measurement

Ming-chun Hsieh; Aiji Suetake; Masahiko Nishijima; Hiroyoshi Yoshida; Rieko Okumura; Hirokazu Tanaka; Hiroki Seto; Hiroshi Nishikawa; Katsuaki Suganuma

doi:10.4071/001c.147105

Hsieh, Ming-chun, Aiji Suetake, Masahiko Nishijima, Hiroyoshi Yoshida, Rieko Okumura, Hirokazu Tanaka, Hiroki Seto, Hiroshi Nishikawa, and Katsuaki Suganuma. 2025. “Enhancing Efficiency in Packaging Substrate Reliability Evaluation Through AC Electrical Resistivity Measurement.” IMAPSource Proceedings 2025 (Symposium): 71–74. https://doi.org/10.4071/001c.147105.

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