ISSN 2380-4505
Vol. 2021, Issue DPC, 2021April 12, 2024 EDT
A New Dual-Band Resonator in Measuring Dielectric Constant at 5G Frequency Band and Yagi Antenna Implemented
A New Dual-Band Resonator in Measuring Dielectric Constant at 5G Frequency Band and Yagi Antenna Implemented
Articles in Vol. 2021, Issue DPC, 2021
Vol. 2021, Issue DPC, 2021
- Viaffirm TM Thin Glass Handling TechnologyAric ShoreyDavid LevyShelby NelsonPaul Ballentine
- Using Deca's Adaptive PatterningTM to Win the Chiplet Integration Race with Siemens EDA and ASERobin GabrielJan KellarKeith FeltonIan GabbitasJohn HuntLihong Cao
- Universal IoT Sensor Platform based on a FOWLP RDLfirst ApproachTanja BraunMathias BöttcherMichael SchifferHarald PötterCarsten BrockmannKarl-Friedrich BeckerDamian FreimundMartin Schneider-Ramelow
- Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G ApplicationHung-Hsien HuangWei-Hong LaiDao-Long ChenDavid TarngCP Hung
- Thermal Interface Materials in the HPC EraAndy C. MackieTim JensenDavid Saums
- System-Level Design Assembly and Management for 3D-IC ArchitecturesBrian Jackson
- Solderless Anisotropic Conductive Film for Compact Package Designs, High-Frequency Signal Integrity, Robust ConnectionsJerry Wu
- SiP in Advanced Automotive PackagingNokibul Islam
- Process Improvements for First Pass Yield Gains during Tri-Temperature Automotive Package TestJerry J. BrozBret A. Humphrey
- Power Packaging Trends in Emerging 48V EcosystemAjay Sattu
- Package Assembly Design Kits - What are They and How Can They Benefit the Packaging Community --- Chiplets and 3D Stacking. An EDA perspective of Heterogenous IntegrationJohn Park
- Magnetic Core Inductor Embedded in Laminates for 3D IntegrationsYanze WuI-Chen YengHongbin Yu
- MAXQFP: NXP New Package Platform for Automotive ApplicationChu-Chung Stephen LeeXS PangJZ YaoTu-Anh TranAndrew Mawer
- Laser Assisted Deposition for Advanced PackagingMichael ZenouHerve Javice
- Known Reliability with Improved Efficiency - The Next Generation Ni/Pd/Au FinishBritta Schafsteller
- Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power SystemsJerry Wu
- Innovative Package on Package Solution: M-Series Fan-Out (mPoP)Byung Cheol Kim
- High Speed Transmission Characteristics on Glass Interposer for High Performance ComputingSatoru KuramochiMasaya Tanaka
- High Performance TIM for Lidded FCBGA ProductsYoungDo Kweon
- Heterogeneous Packaging Optimizing Performance and CostMike Kelly
- Glass Carriers with Matched CTEs for Wafer Thinning ApplicationsIndrajit (Indy) DuttaJay ZhangAndy TengSteven LinErica ChangJulia BruecknerVarun Singh
- Flexibility of System Technology Co-Optimization (STCO) Demands a Shift-Left Process and MethodologyPer Viklund
- Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous IntegrationEvan Griffith
- Emerging Process and Assembly Challenges in Electronics ManufacturingGlenn Farris
- Die-to-Die Interconnect Design and Simulation for 2.3D Organic Interposer PackageCindy MuirBernd WaidhasAbdallah BachaCarlton HannaBeth Keser
- Die-first and RDL-first FOWLP Processing for Flexible Hybrid ElectronicsTakafumi (Tak) FukushimaYuki SusumagoNoriyuki TakahashiHisashi KinoTetsu Tanaka
- Design of Subsystem Module Package for Power Distribution NetworkHoJeong Lim
- Chip Scale Power Transistor PackagingShaun Bowers
- Challenges for Achieving Automotive Grade 1/0 Reliability in FCBGA and fcCSP PackagesKnowlton Olmstead
- Analysis and Management of the Effects of Fluorinated Gases during Plasma DicingJanet HopkinsDavid ParkerRichard Barnett
- Aerosol Jet Printed 3D Interconnects Enable Millimeter Wave Applications over 100GHzBryan Germann
- Advanced Packaging Dielectric for 5GPawel MiskiewiczGreg LarbigNoboru SatakeJens PradellaFrank MeyerMatthias Koch
- Advanced Materials for Automotive SiP ApplicationsKen Araujo
- A Viable Copper Based Alternative to Palladium Activation Systems for Electroless Copper ProcessingRoger MasseyAndre BeyerJosef GaidaLaurence J. GregoriadesStefan KempaAndreas KirbsJan KnaupJulia LehmannLutz StampYvonne WelzSebastian Zarwell
- A Low Tg Bonding Material for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) ProcessesArthur SouthardRachel CartayaDongshun BaiJohn Massey
- 3D Packaging from Edge to the Datacenter: An Imperative for the Next DecadeVaibhav Trivedi
- 2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder AssemblyCharles WoychikRobert MundellaLarry BlackJustin BorskiRobert Nead
- Setting the 600mm Large Panel Fan-Out Standard with M-Series ™Cliff SandstromTim OlsonBenedict San JoseCraig Bishop
- Improving Seed Layer Adhesion and Reliability through RIE Pre-treatmentMohamed ElghazzaliRoland Rettenmeier
- Electromigration Study of a Novel Cu Stack-via Interconnect for Advanced High-Density Fan-Out PackagingKuan-Ju ShaoMin-Yan TsaiChien-Lung LiangChin-Li KaoGao-Tian LinKwang-Lung Lin
- Effect of Silicon BEOL Presence on Solder Fatigue Life During Board-Level Thermal Cycling of WLCSPRameen HadizadehYaoyu PangAnuj Patel
- Cost Analysis of Lithography Options for Panel-Level Fan-Out PackagingAmy P. Lujan
- Chip Package Bumping on Wafer-Level for RDL First Fan-Out WafersAnshuma PathakMathias BöttcherSebastiaan KersjesThomas OppertThorsten Teutsch
- Chemistry and Process Considerations for the Removal of Residues for Hybrid BondingPhillip TylerIan CochranJonathan FijalJohn TaddeiThomas WorkmanDominik SuwitoGuilian GaoGabe GuevaraGill FountainCyprian UzohJeremy TheilLaura Mirkarimi
- Advancements of Temporary Bond and Debond: Creating Photonic Debonding Methods and Materials for Wafer-Level PackagingLuke Prenger
- Adaptive Patterning Techniques for the Chiplet EraCraig Bishop
- A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid BondingBaron HuangDuo TsaiXiao LiuRama Puligadda
- Thiol-based, Thermally-Conductive Adhesives for High Power ElectronicsBenjamin LundCarlos BarriosMahmoud HosseiniXun HanAli AlievRay BaughmanWalter Voit
- The Future is Heterogeneous Integration IMAPS Global Business CouncilWilliam Chen
- TLPS Pastes for Anywhere Embedded Passive Components in Substrates and PCBsCatherine ShearerGary Legerton
- Substrates for Heterogeneous IntegrationJohn H. Lau
- Stress Reduced Embedded Die Substrate Structure Fabricated for Heterogeneous Integration Using Selective Laser AblationMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Reliability Evaluation of a Low Loss PhotodielectricKatie HanYasumasa AkatsukaJenna CorderoDaniel Nawrocki
- Recent Developments of Resonator Measurements for Emerging Materials and TechnologiesM. Olszewska-PlachaM. Celuch
- Modernization of Metrology for Metallization Solutions with ICP - A Quality Control RequirementPaul OkagbareMichael MacEwanEugene Shalyt
- Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor PackagingNavid Kazem
- Investigation of Low Temperature Bonding Process based on Cu/Ni/In Solid Liquid InterdiffusionAdil ShehzadSteffen BickelIuliana PanchenkoJürgen M. WolfWolfram StellerBenedikt WolframMaksym Myndyk
- Innovative PVD Technology Solutions for Advanced Substrate, EMI Shielding, and Backside MetalJeff Turner
- Increasing Role of Glass in the Semiconductor Applications: Market, Technology Trends, Supply Chain Evolution and ChallengesSantosh Kumar
- High Frequency Measurements Using Wafer Level TechniquesNate Orloff
- Heterogeneous Integration: Opportunities and ChallengesE. Jan Vardaman
- Enabling the Transition to Heterogeneous IntegrationBryan Black
- Design and Simulation of 3D TSV Inductor for IoT ApplicationsBruce Kim
- Challenges for High Frequency Measurement of Low Loss Dielectric MaterialUrmi Ray
- Carbon-Based Thermal Interface Materials for High-Power Device PackagingKevin BrennerPaul XuJesus Alejandro Bolivar
- Benchmarking Resonator Based Low dk-df Material MeasurementsRichard Stephenson
- Automotive Packaging - System Integration and ReliabilityThorsten Meyer
- Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale SimulationAndrea R. BrowningSimon D. ElliottH. Shaun KwakMohammad Atif Faiz AfzalAnand ChandrasekaranTsuguo MorisatoAlexander GoldbergMathew D. Halls
- Ag-Diamond Heatspreader for Power DevicesTakara Okubo
- A New Dual-Band Resonator in Measuring Dielectric Constant at 5G Frequency Band and Yagi Antenna ImplementedChia-Chu LaiHo-Chuan LinTeny ShihDavid LaiYu-Po Wang
- Optimizing Measurement Accuracy and Repeatability for High Frequency MeasurementsSay Phommakesone
- 2D Materials for BEOL ApplicationsZhihong Chen
Lai, Chia-Chu, Ho-Chuan Lin, Teny Shih, David Lai, and Yu-Po Wang. 2024. “A New Dual-Band Resonator in Measuring Dielectric Constant at 5G Frequency Band and Yagi Antenna Implemented.” IMAPSource Proceedings 2021 (DPC): 1317–23. https://doi.org/10.4071/001c.116545.