ISSN 2380-4505
Vol. 2021, Issue DPC, 2021April 09, 2024 EDT
Emerging Process and Assembly Challenges in Electronics Manufacturing
Emerging Process and Assembly Challenges in Electronics Manufacturing
Articles in Vol. 2021, Issue DPC, 2021
Vol. 2021, Issue DPC, 2021
- Viaffirm TM Thin Glass Handling TechnologyAric ShoreyDavid LevyShelby NelsonPaul Ballentine
- Using Deca's Adaptive PatterningTM to Win the Chiplet Integration Race with Siemens EDA and ASERobin GabrielJan KellarKeith FeltonIan GabbitasJohn HuntLihong Cao
- Universal IoT Sensor Platform based on a FOWLP RDLfirst ApproachTanja BraunMathias BöttcherMichael SchifferHarald PötterCarsten BrockmannKarl-Friedrich BeckerDamian FreimundMartin Schneider-Ramelow
- Thermal Performance Enhancement of Dual Side Molding SiP Module for 5G ApplicationHung-Hsien HuangWei-Hong LaiDao-Long ChenDavid TarngCP Hung
- Thermal Interface Materials in the HPC EraAndy C. MackieTim JensenDavid Saums
- System-Level Design Assembly and Management for 3D-IC ArchitecturesBrian Jackson
- Solderless Anisotropic Conductive Film for Compact Package Designs, High-Frequency Signal Integrity, Robust ConnectionsJerry Wu
- SiP in Advanced Automotive PackagingNokibul Islam
- Process Improvements for First Pass Yield Gains during Tri-Temperature Automotive Package TestJerry J. BrozBret A. Humphrey
- Power Packaging Trends in Emerging 48V EcosystemAjay Sattu
- Package Assembly Design Kits - What are They and How Can They Benefit the Packaging Community --- Chiplets and 3D Stacking. An EDA perspective of Heterogenous IntegrationJohn Park
- Magnetic Core Inductor Embedded in Laminates for 3D IntegrationsYanze WuI-Chen YengHongbin Yu
- MAXQFP: NXP New Package Platform for Automotive ApplicationChu-Chung Stephen LeeXS PangJZ YaoTu-Anh TranAndrew Mawer
- Laser Assisted Deposition for Advanced PackagingMichael ZenouHerve Javice
- Known Reliability with Improved Efficiency - The Next Generation Ni/Pd/Au FinishBritta Schafsteller
- Investigation of Carbon Fiber TIM Gap Pad for Enabling Next Generation Automotive High-Power SystemsJerry Wu
- Innovative Package on Package Solution: M-Series Fan-Out (mPoP)Byung Cheol Kim
- High Speed Transmission Characteristics on Glass Interposer for High Performance ComputingSatoru KuramochiMasaya Tanaka
- High Performance TIM for Lidded FCBGA ProductsYoungDo Kweon
- Heterogeneous Packaging Optimizing Performance and CostMike Kelly
- Glass Carriers with Matched CTEs for Wafer Thinning ApplicationsIndrajit (Indy) DuttaJay ZhangAndy TengSteven LinErica ChangJulia BruecknerVarun Singh
- Flexibility of System Technology Co-Optimization (STCO) Demands a Shift-Left Process and MethodologyPer Viklund
- Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous IntegrationEvan Griffith
- Emerging Process and Assembly Challenges in Electronics ManufacturingGlenn Farris
- Die-to-Die Interconnect Design and Simulation for 2.3D Organic Interposer PackageCindy MuirBernd WaidhasAbdallah BachaCarlton HannaBeth Keser
- Die-first and RDL-first FOWLP Processing for Flexible Hybrid ElectronicsTakafumi (Tak) FukushimaYuki SusumagoNoriyuki TakahashiHisashi KinoTetsu Tanaka
- Design of Subsystem Module Package for Power Distribution NetworkHoJeong Lim
- Chip Scale Power Transistor PackagingShaun Bowers
- Challenges for Achieving Automotive Grade 1/0 Reliability in FCBGA and fcCSP PackagesKnowlton Olmstead
- Analysis and Management of the Effects of Fluorinated Gases during Plasma DicingJanet HopkinsDavid ParkerRichard Barnett
- Aerosol Jet Printed 3D Interconnects Enable Millimeter Wave Applications over 100GHzBryan Germann
- Advanced Packaging Dielectric for 5GPawel MiskiewiczGreg LarbigNoboru SatakeJens PradellaFrank MeyerMatthias Koch
- Advanced Materials for Automotive SiP ApplicationsKen Araujo
- A Viable Copper Based Alternative to Palladium Activation Systems for Electroless Copper ProcessingRoger MasseyAndre BeyerJosef GaidaLaurence J. GregoriadesStefan KempaAndreas KirbsJan KnaupJulia LehmannLutz StampYvonne WelzSebastian Zarwell
- A Low Tg Bonding Material for Use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) ProcessesArthur SouthardRachel CartayaDongshun BaiJohn Massey
- 3D Packaging from Edge to the Datacenter: An Imperative for the Next DecadeVaibhav Trivedi
- 2-High Stacked Heterogeneous System-in-Package (HSIP) Modules Using Solder AssemblyCharles WoychikRobert MundellaLarry BlackJustin BorskiRobert Nead
- Setting the 600mm Large Panel Fan-Out Standard with M-Series ™Cliff SandstromTim OlsonBenedict San JoseCraig Bishop
- Improving Seed Layer Adhesion and Reliability through RIE Pre-treatmentMohamed ElghazzaliRoland Rettenmeier
- Electromigration Study of a Novel Cu Stack-via Interconnect for Advanced High-Density Fan-Out PackagingKuan-Ju ShaoMin-Yan TsaiChien-Lung LiangChin-Li KaoGao-Tian LinKwang-Lung Lin
- Effect of Silicon BEOL Presence on Solder Fatigue Life During Board-Level Thermal Cycling of WLCSPRameen HadizadehYaoyu PangAnuj Patel
- Cost Analysis of Lithography Options for Panel-Level Fan-Out PackagingAmy P. Lujan
- Chip Package Bumping on Wafer-Level for RDL First Fan-Out WafersAnshuma PathakMathias BöttcherSebastiaan KersjesThomas OppertThorsten Teutsch
- Chemistry and Process Considerations for the Removal of Residues for Hybrid BondingPhillip TylerIan CochranJonathan FijalJohn TaddeiThomas WorkmanDominik SuwitoGuilian GaoGabe GuevaraGill FountainCyprian UzohJeremy TheilLaura Mirkarimi
- Advancements of Temporary Bond and Debond: Creating Photonic Debonding Methods and Materials for Wafer-Level PackagingLuke Prenger
- Adaptive Patterning Techniques for the Chiplet EraCraig Bishop
- A Novel Photosensitive Permanent Bonding Material for Polymer/Metal Hybrid BondingBaron HuangDuo TsaiXiao LiuRama Puligadda
- Thiol-based, Thermally-Conductive Adhesives for High Power ElectronicsBenjamin LundCarlos BarriosMahmoud HosseiniXun HanAli AlievRay BaughmanWalter Voit
- The Future is Heterogeneous Integration IMAPS Global Business CouncilWilliam Chen
- TLPS Pastes for Anywhere Embedded Passive Components in Substrates and PCBsCatherine ShearerGary Legerton
- Substrates for Heterogeneous IntegrationJohn H. Lau
- Stress Reduced Embedded Die Substrate Structure Fabricated for Heterogeneous Integration Using Selective Laser AblationMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Reliability Evaluation of a Low Loss PhotodielectricKatie HanYasumasa AkatsukaJenna CorderoDaniel Nawrocki
- Recent Developments of Resonator Measurements for Emerging Materials and TechnologiesM. Olszewska-PlachaM. Celuch
- Modernization of Metrology for Metallization Solutions with ICP - A Quality Control RequirementPaul OkagbareMichael MacEwanEugene Shalyt
- Liquid Metal Embedded Elastomers (LMEEs) as an Emerging Material Architecture for TIMs in Semiconductor PackagingNavid Kazem
- Investigation of Low Temperature Bonding Process based on Cu/Ni/In Solid Liquid InterdiffusionAdil ShehzadSteffen BickelIuliana PanchenkoJürgen M. WolfWolfram StellerBenedikt WolframMaksym Myndyk
- Innovative PVD Technology Solutions for Advanced Substrate, EMI Shielding, and Backside MetalJeff Turner
- Increasing Role of Glass in the Semiconductor Applications: Market, Technology Trends, Supply Chain Evolution and ChallengesSantosh Kumar
- High Frequency Measurements Using Wafer Level TechniquesNate Orloff
- Heterogeneous Integration: Opportunities and ChallengesE. Jan Vardaman
- Enabling the Transition to Heterogeneous IntegrationBryan Black
- Design and Simulation of 3D TSV Inductor for IoT ApplicationsBruce Kim
- Challenges for High Frequency Measurement of Low Loss Dielectric MaterialUrmi Ray
- Carbon-Based Thermal Interface Materials for High-Power Device PackagingKevin BrennerPaul XuJesus Alejandro Bolivar
- Benchmarking Resonator Based Low dk-df Material MeasurementsRichard Stephenson
- Automotive Packaging - System Integration and ReliabilityThorsten Meyer
- Analysis of Advanced Polymer Semiconductor Packaging Materials by Atomic Scale SimulationAndrea R. BrowningSimon D. ElliottH. Shaun KwakMohammad Atif Faiz AfzalAnand ChandrasekaranTsuguo MorisatoAlexander GoldbergMathew D. Halls
- Ag-Diamond Heatspreader for Power DevicesTakara Okubo
- A New Dual-Band Resonator in Measuring Dielectric Constant at 5G Frequency Band and Yagi Antenna ImplementedChia-Chu LaiHo-Chuan LinTeny ShihDavid LaiYu-Po Wang
- Optimizing Measurement Accuracy and Repeatability for High Frequency MeasurementsSay Phommakesone
- 2D Materials for BEOL ApplicationsZhihong Chen
Farris, Glenn. 2024. “Emerging Process and Assembly Challenges in Electronics Manufacturing.” IMAPSource Proceedings 2021 (DPC): 1185–1201. https://doi.org/10.4071/001c.116345.