Vol. 2021, Issue DPC, 2021April 12, 2024 EDT
Stress Reduced Embedded Die Substrate Structure Fabricated for Heterogeneous Integration Using Selective Laser Ablation
Stress Reduced Embedded Die Substrate Structure Fabricated for Heterogeneous Integration Using Selective Laser Ablation
Matsuura, Masamitsu, Tanemasa Asano, and Haruichi Kanaya. 2024. “Stress Reduced Embedded Die Substrate Structure Fabricated for Heterogeneous Integration Using Selective Laser Ablation.” IMAPSource Proceedings 2021 (DPC): 1338–41. https://doi.org/10.4071/001c.116541.