Vol. 2021, Issue DPC, 2021April 11, 2024 EDT
Chip Package Bumping on Wafer-Level for RDL First Fan-Out Wafers
Chip Package Bumping on Wafer-Level for RDL First Fan-Out Wafers
Pathak, Anshuma, Mathias Böttcher, Sebastiaan Kersjes, Thomas Oppert, and Thorsten Teutsch. 2024. “Chip Package Bumping on Wafer-Level for RDL First Fan-Out Wafers.” IMAPSource Proceedings 2021 (DPC): 641–57. https://doi.org/10.4071/001c.116494.