ISSN 2380-4505
Miskiewicz, Pawel, Greg Larbig, Noboru Satake, Jens Pradella, Frank Meyer, and Matthias Koch. 2024. “Advanced Packaging Dielectric for 5G.” IMAPSource Proceedings 2021 (DPC): 1165–84. https://doi.org/10.4071/001c.116340.
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