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Device Packaging Conference Presentations
Vol. 2021, Issue DPC, 2021April 12, 2024 EDT

Ag-Diamond Heatspreader for Power Devices

Takara Okubo,
Ag-diamond heatspreaderpower devicesthermal mangementreliabilityheatspreader
https://doi.org/10.4071/001c.116533
IMAPSource Conference Papers
Okubo, Takara. 2024. “Ag-Diamond Heatspreader for Power Devices.” IMAPSource Proceedings 2021 (DPC): 1236–50. https:/​/​doi.org/​10.4071/​001c.116533.
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