MAXQFP: NXP New Package Platform for Automotive Application

Chu-Chung Stephen Lee; XS Pang; JZ Yao; Tu-Anh Tran; Andrew Mawer

doi:10.4071/001c.116351

Lee, Chu-Chung Stephen, XS Pang, JZ Yao, Tu-Anh Tran, and Andrew Mawer. 2024. “MAXQFP: NXP New Package Platform for Automotive Application.” IMAPSource Proceedings 2021 (DPC): 921–31. https://doi.org/10.4071/001c.116351.

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MAXQFP: NXP New Package Platform for Automotive Application

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