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Device Packaging Conference Presentations
Vol. 2016, Issue DPC, 2016
January 01, 2016 EDT
Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform
Miguel Jimarez
,
Si Photonics
Cu Pillar
Chip on wafer
copper pillar
high-speed
transceiver
CoW
•
https://doi.org/10.4071/2016DPC-WP41
IMAPSource Conference Papers
Jimarez, Miguel. 2016. “Si Photonics Deployment Using Cu Pillar Interconnect and Chip On Wafer Platform.”
IMAPSource Proceedings
2016 (DPC): 1663–81.
https://doi.org/10.4071/2016DPC-WP41
.
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